Thermal/Mechanical Intern — Hybrid, Server Cooling Focus

Hewlett Packard Enterprise; Spring (TX); Hybrid; USD 48,000 - 56,000; Part time

Job summary

Hewlett Packard Enterprise is seeking a motivated Thermal/Mechanical Engineering Intern to support design, analysis, testing, and validation of next-generation server hardware. You will work with experienced engineers on cooling and mechanical solutions for compute-heavy platforms, gaining hands-on exposure to air and liquid cooling, and lab testing.

This hybrid role requires pursuing a degree in Mechanical or Aerospace Engineering and offers an opportunity to contribute to CAD, CFD/FEA, data

Qualifications

• Completed coursework in heat transfer, thermodynamics, fluid mechanics.
• Understanding of conduction, convection, pressure drop, airflow and mechanical loads.
• Able to apply engineering concepts and communicate results clearly.
• Basic spreadsheet and presentation skills.
• Detail-oriented with hands-on lab experience.
• Able to collaborate in a multidisciplinary engineering team.

Responsibilities

• Support mechanical and thermal development of rack-mount server platforms and components.
• Design and evaluate heat sinks, fans, ducts, cold plates, brackets and other hardware.
• Build and instrument server prototypes for thermal, airflow, acoustic and mechanical testing.
• Measure temperatures, airflow, pressure, power and environmental conditions in the lab.
• Execute test plans, maintain records, analyze results and summarize findings in reports.
• Support workload and stress testing of CPUs, GPUs, DIMMs, drives and power supplies.
• Assist with CAD, tolerance analysis, thermal modeling, CFD or FEA under senior engineers.
• Investigate test anomalies and troubleshoot prototype issues using structured methods.
• Participate in design reviews with cross-functional teams.
• Research emerging server-cooling technologies and practices.
• Follow lab safety procedures and keep the workspace organized.

Skills

Heat transfer

Thermodynamics

Fluid mechanics

Mechanical design

Lab work

Education

Bachelor's or Master's in Mechanical/Aerospace Engineering

Job description

Hewlett Packard Enterprise is seeking a motivated Thermal/Mechanical Engineering Intern to support design, analysis, testing, and validation of next-generation server hardware. You will work with experienced engineers on cooling and mechanical solutions for compute-heavy platforms, gaining hands-on exposure to air and liquid cooling, and lab testing.

This hybrid role requires pursuing a degree in Mechanical or Aerospace Engineering and offers an opportunity to contribute to CAD, CFD/FEA, data