Thermal Mechanical Engineer - Onsite Lead

Hewlett Packard Enterprise Company; Chippewa Falls (WI); In loco; USD 74.000 - 170.000; Tempo pieno

Descrizione del lavoro

Hewlett Packard Enterprise in Wisconsin is seeking a Mechanical/Hardware Engineer (Thermal) to design, analyze, and validate cooling solutions for server hardware. The role focuses on system-level thermal design, fan and heatsink technologies, and ensuring cost-effective, best-in-class cooling.

You will lead multi-disciplinary teams, collaborate with vendors, and perform thermal simulations using CFD tools.

Competenze

• Bachelor's or Master's degree in Mechanical Engineering.
• Typically 2–4 years experience.
• Experience with thermal design and CFD.
• Proficiency in mechanical design for sheet metal and plastics.

Mansioni

• Leads multiple project teams of mechanical hardware engineers and internal and outsourced development partners responsible for all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling and testing.
• Manages and expands relationships with internal and outsourced development partners on mechanical and thermal design and development
• Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; provides tangible feedback to improve product quality
• Provides domain-specific expertise and overall mechanical/thermal leadership and perspective to cross-organization projects, programs, and activities
• Drives innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization.
• Provides guidance and mentoring to less- experienced staff members
• Communicates well verbally, in writing, and graphically
• Works independently and as part of a team

Conoscenze

Analytical skills

Problem solving

Communication skills

Team leadership

Formazione

Bachelor's degree in Mechanical Engineering

Master's degree in Mechanical Engineering

Strumenti

ProEngineer

3D CAD

Descrizione del lavoro

Hewlett Packard Enterprise in Wisconsin is seeking a Mechanical/Hardware Engineer (Thermal) to design, analyze, and validate cooling solutions for server hardware. The role focuses on system-level thermal design, fan and heatsink technologies, and ensuring cost-effective, best-in-class cooling.

You will lead multi-disciplinary teams, collaborate with vendors, and perform thermal simulations using CFD tools.