Onsite Mechanical & Thermal Hardware Engineer — Design

Hewlett Packard Enterprise Company

Chippewa Falls (WI)

Sur place

USD 74 000 - 170 000

Plein temps

Il y a 5 jours
Soyez parmi les premiers à postuler

Obtenez une réponse de cet employeur

Votre CV et votre lettre de motivation, adaptés exactement à ce que l’employeur recherche.

Passez les filtres ATS

Résumé du poste

Hewlett Packard Enterprise Company is seeking a Mechanical/Thermal Hardware Engineer for an onsite role in Wisconsin. You will design, analyze, develop and validate mechanical systems, electronics enclosures and production tooling, applying CFD and thermal analysis to validate solutions.

You should hold a Bachelor's or Master's in Mechanical Engineering with 2–4 years of experience, strong CAD skills (ProEngineer, SolidWorks) and good communication.

Qualifications

  • Bachelor's or Master's degree in Mechanical Engineering.
  • Typically 2–4 years experience.
  • Strong written and verbal communication skills; mastery in English and local language.
  • Ability to apply analytical and problem solving skills.

Responsabilités

  • Designs portions of engineering solutions for mechanical and thermal hardware, electronics enclosures, and production tooling based on established engineering principles and in accordance with development technology practices and guidelines.
  • Develops and implements parameters and test plans for existing designs, including validation of tolerances, form/fit/function, shock and vibration, electromagnetic interference, safety, reliability, developing fan curves, system power measurements & acoustics.
  • Collaborates and communicates with internal and outsourced development partners on mechanical and thermal design and development.
  • Participates as a member of project team of other mechanical hardware engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for low to moderately- complex products.

Connaissances

Analytical problem solving
English communication

Formation

Bachelor's or Master's degree in Mechanical Engineering

Outils

ProEngineer
SolidWorks
CFD

Description du poste

Hewlett Packard Enterprise Company is seeking a Mechanical/Thermal Hardware Engineer for an onsite role in Wisconsin. You will design, analyze, develop and validate mechanical systems, electronics enclosures and production tooling, applying CFD and thermal analysis to validate solutions.

You should hold a Bachelor's or Master's in Mechanical Engineering with 2–4 years of experience, strong CAD skills (ProEngineer, SolidWorks) and good communication.

Obtenez votre examen gratuit et confidentiel de votre CV.

ou faites glisser et déposez votre fichier ici.

Similar jobs

Postes similaires à comparer

Onsite Thermal & Mechanical Hardware Engineer
Onsite Thermal & Mechanical Hardware Engineer

Hewlett Packard Enterprise • Chippewa Falls (WI)

Sur place
USD 74 000 - 170 000
Thermal Mechanical Engineer - Lead & Innovate (Onsite)
Thermal Mechanical Engineer - Lead & Innovate (Onsite)

Hewlett Packard Enterprise • Chippewa Falls (WI)

Sur place
USD 74 000 - 170 000
Health & Wellbeing
Personal & Professional Development
Unconditional Inclusion
Thermal Mechanical Engineer - Onsite Lead
Thermal Mechanical Engineer - Onsite Lead

Hewlett Packard Enterprise Company • Chippewa Falls (WI)

Sur place
USD 74 000 - 170 000
Mechanical Design Engineer – Enclosures & Thermal
Mechanical Design Engineer – Enclosures & Thermal

Hewlett Packard Enterprise • Chippewa Falls (WI)

Sur place
USD 65 000 - 151 000
Entry-Level Mechanical Hardware Engineer — Onsite
Entry-Level Mechanical Hardware Engineer — Onsite

Hewlett Packard Enterprise Company in • Roseville (CA)

Sur place
USD 74 000 - 151 000
Onsite Mechanical Engineering Manager
Onsite Mechanical Engineering Manager

Hewlett Packard Enterprise Development LP • Chippewa Falls (WI)

Sur place
USD 120 000 - 275 000
Health & Wellbeing
Personal & Professional Development
Unconditional Inclusion
Hybrid Hardware Mechanical Engineer II - Design & Thermal
Hybrid Hardware Mechanical Engineer II - Design & Thermal

Hewlett Packard Enterprise • Spring (TX)

Hybride
USD 63 000 - 145 000
Mechanical Hardware Engineer II - Thermal & Enclosures
Mechanical Hardware Engineer II - Thermal & Enclosures

Hewlett Packard Enterprise Company • Spring (TX)

Hybride
USD 63 000 - 145 000
Hybrid work schedule
Mechanical/Thermal Hardware Engineer
Mechanical/Thermal Hardware Engineer

Hewlett Packard Enterprise Company • Chippewa Falls (WI)

Sur place
USD 74 000 - 170 000
Hybrid Hardware Mechanical Engineer II (Thermal/CFD)
Hybrid Hardware Mechanical Engineer II (Thermal/CFD)

Hewlett Packard Enterprise • Durham (NC)

Hybride
USD 63 000 - 145 000