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Hewlett Packard Enterprise is seeking a Mechanical Hardware Engineer I to design mechanical/thermal hardware, electronics enclosures, and production tooling. The role involves working onsite in California and collaborating with internal and external partners on validated designs and tooling.
The candidate should have a Bachelor's or Master's in Mechanical Engineering with 0–2 years of experience, and knowledge of 3D CAD (ProEngineer) and thermal design concepts.
Hewlett Packard Enterprise is seeking a Mechanical Hardware Engineer I to design mechanical/thermal hardware, electronics enclosures, and production tooling. The role involves working onsite in California and collaborating with internal and external partners on validated designs and tooling.
The candidate should have a Bachelor's or Master's in Mechanical Engineering with 0–2 years of experience, and knowledge of 3D CAD (ProEngineer) and thermal design concepts.