Mechanical Hardware Engineer II - Thermal & Enclosures

Hewlett Packard Enterprise Company; Spring (TX); Hybrid; USD 63,000 - 145,000; Full time

Benefits offered by this job

Hybrid work schedule

Job summary

Hewlett Packard Enterprise is seeking a Hardware Mechanical Engineer II for a hybrid role, averaging two days per week in an HPE office. You will design mechanical and thermal hardware, develop validation plans, and collaborate with partners to deliver cost-effective, reliable solutions.

The role requires a Bachelor’s or Master’s in Mechanical Engineering (or equivalent) and typically 2–4 years of experience, with strong Creo and analytical skills.

Qualifications

• Bachelor's or Master's in Mechanical Engineering or equivalent required.
• Typically 2–4 years of experience.
• Proficiency with Creo or similar 3D CAD software.

Responsibilities

• Design mechanical and thermal hardware and production tooling.
• Develop test plans and validate tolerances, vibration, EMI, acoustics.
• Collaborate with internal and external partners on design and development.
• Contribute to a project team to deliver reliable, cost-effective solutions.

Skills

Creo

3D CAD

CFD

Thermal analysis

Communication

Education

Bachelor's or Master's in Mechanical Engineering

Tools

Creo

Job description

Hewlett Packard Enterprise is seeking a Hardware Mechanical Engineer II for a hybrid role, averaging two days per week in an HPE office. You will design mechanical and thermal hardware, develop validation plans, and collaborate with partners to deliver cost-effective, reliable solutions.

The role requires a Bachelor’s or Master’s in Mechanical Engineering (or equivalent) and typically 2–4 years of experience, with strong Creo and analytical skills.