Thermal/Mechanical Engineer: Data Center Cooling & SoC

Amazon Web Services (AWS); Seattle (WA); On-site; USD 136,000 - 184,000; Full time

Job summary

Annapurna Labs (U.S.) Inc. is seeking a Thermal/Mechanical Engineer to design and optimize cooling solutions for our data center hardware.

You will develop from circuit-level concepts to system-level packaging, ensuring reliable performance while meeting cost and power constraints. You will work with silicon teams, ODMs and internal design groups across sites to model, prototype and validate thermal behavior in air- and liquid-cooled systems, contributing to scalable, high-volume AWS

Qualifications

• BS or MS degree in Mechanical/Thermal Engineering.
• 3+ years industry experience in Mechanical and Thermal design of Systems.
• Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems.
• 3+ years of experience SoC Thermal modelling and IC package transient thermal response.
• Experience with Chip package, System Mechanical & Thermal design for air-coolled and liquid-coolled systems.
• Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use.
• Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization.

Responsibilities

• Design and build the systems that are the heart of the world’s largest computing infrastructure, from circuit design to high-volume manufacturing.
• Lead in applying new technologies to large-scale server deployments to improve performance, quality and cost.

Skills

Mechanical design collaboration

Thermal design experience

CFD/thermal modelling

Cross-site collaboration

Education

BS or MS degree in Mechanical/Thermal Engineering

Tools

Ansys Icepak

FloTherm

Cadence Celsius

PTC Creo

SolidWorks

Job description

Annapurna Labs (U.S.) Inc. is seeking a Thermal/Mechanical Engineer to design and optimize cooling solutions for our data center hardware.

You will develop from circuit-level concepts to system-level packaging, ensuring reliable performance while meeting cost and power constraints. You will work with silicon teams, ODMs and internal design groups across sites to model, prototype and validate thermal behavior in air- and liquid-cooled systems, contributing to scalable, high-volume AWS