Mechanical Engineer, Annapurna Labs, Machine Learning Hardware

Amazon Web Services (AWS); Seattle (WA); On-site; USD 136,000 - 184,000; Full time

Job summary

Annapurna Labs (U.S.) Inc. is seeking a Thermal/Mechanical Engineer to design and optimize cooling solutions for our data center hardware.

You will develop from circuit-level concepts to system-level packaging, ensuring reliable performance while meeting cost and power constraints. You will work with silicon teams, ODMs and internal design groups across sites to model, prototype and validate thermal behavior in air- and liquid-cooled systems, contributing to scalable, high-volume AWS

Qualifications

• BS or MS degree in Mechanical/Thermal Engineering.
• 3+ years industry experience in Mechanical and Thermal design of Systems.
• Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems.
• 3+ years of experience SoC Thermal modelling and IC package transient thermal response.
• Experience with Chip package, System Mechanical & Thermal design for air-coolled and liquid-coolled systems.
• Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use.
• Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization.

Responsibilities

• Design and build the systems that are the heart of the world’s largest computing infrastructure, from circuit design to high-volume manufacturing.
• Lead in applying new technologies to large-scale server deployments to improve performance, quality and cost.

Skills

Mechanical design collaboration

Thermal design experience

CFD/thermal modelling

Cross-site collaboration

Education

BS or MS degree in Mechanical/Thermal Engineering

Tools

Ansys Icepak

FloTherm

Cadence Celsius

PTC Creo

SolidWorks

Job description

Description

Annapurna Labs (our organization within Amazon) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.

As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

Key job responsibilities

As a Thermal/Mechanical Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of AWS users.

About The Team

In 2015, Annapurna Labs was acquired by Amazon Web Services (AWS). Since then, we have accelerated its innovation and developed a number of products that benefit cloud customers, including AWS Nitro technology, Inferentia custom Machine Learning chips, and AWS Graviton2 processors.

Annapurna Labs is a silicon/system and software organization that is delivering all the chips used by AWS customers. Today this includes: Graviton, driving innovation for general purpose compute; Nitro, driving networking and storage scale, security and Hypervisor offload, and Machine Learning (ML) Trainium and Inferentia that are enabling customers to train and run GenAI applications permanently while keeping costs under control.

Basic Qualifications

• BS or MS degree in Mechanical/Thermal Engineering
• 3+ years industry experience in Mechanical and Thermal design of Systems
• Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems
• 3+ years of experience SoC Thermal modelling and IC package transient thermal response
• Experience with Chip package, System Mechanical & Thermal design for air-coolled and liquid-coolled systems
• Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use
• Work with ODMs, heatsink vendors, and internal design teams on cross-boundary triaging, debugging, and resolving issues across organization

Preferred Qualifications

• Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques
• Tool Familiarity: Ansys Icepak, FloTherm, Cadence Celsius, PTC Creo, and Solidworks
• Programming experience: Bash script, Shell script, Linux, Python, and Lua. Familiarity with working in Linux environment is an added advantage
• Working knowledge on fans, valves, chillers, and CDUs
• Knowledge of various types of technologies used for Heatsink solutions, Thermal Interface Materials (TIMs) and liquid cooling technologies
• Develop detailed CFD and compact RC models for SoC and Package thermal analysis
• Knowledge of hardware and software based thermal / power management control algorithms
• Optimize thermal solutions under PPA and system design constraints
• Simulate and prototype thermal control strategies
• Validate thermal models through power/thermal measurements on Hardware

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.

Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.

USA, TX, Austin - 136,000.00 - 184,000.00 USD annually

USA, WA, Seattle - 136,000.00 - 184,000.00 USD annually

Company

- Annapurna Labs (U.S.) Inc.

Job ID: A10440713