Senior Mechanical Engineer - AI Hardware Thermal Lead

Amazon; Seattle (WA); On-site; USD 159,000 - 215,000; Full time

Benefits offered by this job

RSUs

Sign-on bonus

Job summary

Annapurna Labs, within AWS, seeks a Sr. Mechanical Engineer to own the thermal and mechanical design for ML/AI accelerator platforms—from rack-level infrastructure to chip packaging.

You will develop cooling solutions, CFD/FEA models, and lead cross-functional teams across silicon, firmware, mechanical, and operations to deliver high-density systems. The role involves driving design standardization, collaborating with ODMs and suppliers, and contributing to the technical direction of the

Qualifications

• BS degree in mechanical engineering or equivalent
• 7+ years industry experience in Mechanical and Thermal design in electronics packaging
• 3+ years of experience in SoC Thermal modelling and IC package transient thermal response
• Experience with chip package, system mechanical & thermal design for air-cooled and liquid-cooled systems
• Experience with tolerance analysis (stack-up/GD&T) and sheet metal or precision-machined component design for electronics packaging
• Experience with production fleet support: telemetry analysis, root cause analysis, and defining mitigation strategies
• Experience leading cross-functional technical projects spanning silicon, firmware, mechanical, and operations teams

Responsibilities

• Own the complete thermal and mechanical design for ML/AI accelerator platforms — from rack-level infrastructure down to chip packaging
• Define thermal and mechanical design requirements, establish design targets, and drive cross-functional alignment that enables parallel development across hardware, firmware, and software teams
• Deliver production platforms through the full lifecycle: concept, design, analysis, prototyping, validation, manufacturing ramp, and fleet operations
• Design and optimize cooling solutions (air and liquid) for high-power-density ML/AI accelerators
• Develop detailed CFD models, compact RC models, and structural FEA for SoC/package thermal analysis and mechanical integrity
• Design rack manifolds, cold plates, and data center liquid cooling interfaces for at-scale liquid-cooled deployments
• Develop and validate mechanical structures including chassis and enclosures for manufacturability, reliability, and serviceability; owning tolerance stack-up analysis, GD&T, and DFM
• Own mechanical design of integrating high-speed interconnect subsystems including cable cartridges, backplane connectors, and mating interfaces
• Perform structural FEA for shock, vibration, and transportation loads to ensure mechanical integrity across the product lifecycle
• Fleet Operations & Reliability — monitor fleet thermal telemetry and perform root cause analysis of thermal and mechanical failures

Skills

Mechanical design

Thermal modelling

CFD modelling

FEA

Cross-functional leadership

Root cause analysis

Education

BS degree in mechanical engineering

Tools

Ansys Icepak

FloTherm

Cadence Celsius

PTC Creo

Solidworks

Job description

Annapurna Labs, within AWS, seeks a Sr. Mechanical Engineer to own the thermal and mechanical design for ML/AI accelerator platforms—from rack-level infrastructure to chip packaging.

You will develop cooling solutions, CFD/FEA models, and lead cross-functional teams across silicon, firmware, mechanical, and operations to deliver high-density systems. The role involves driving design standardization, collaborating with ODMs and suppliers, and contributing to the technical direction of the