3D IC Applications Engineer — Hybrid & Travel

Siemens Mobility; Boulder (CO); Hybrid; USD 125,000 - 251,000; Full time

Job summary

Siemens EDA is seeking an Applications Engineer to support consultative sales in the US, focusing on IC packaging and 3DIC solutions. You will deliver technical presentations, run product demos, and help architect prototype flows to integrate Siemens EDA tools into customer designs.

The role requires 4+ years in IC package/layout design, familiarity with Verilog/LEF/DEF/GDS, and travel up to domestic and international locations.

Qualifications

• MSEE/BSEE with 4+ years design experience.
• Experience in advanced IC Package layout design and/or interposer layout design.
• Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS).
• Experience with package design tools from setup to manufacturing documents.
• Familiarity with package/interposer planning solutions.
• Proficiency with MS Office tools.

Responsibilities

• Secure technical design wins for Siemens EDA offerings.
• Deliver technical presentations, demos and benchmarks.
• Develop flows and integration scripts for 3DIC solutions.
• Travel domestically and internationally as required.

Skills

IC package design

package/interposer planning

2.5D/3D chiplet design

IC data formats

signal/power integrity tools

Calibre DRC/LVS/3DSTACK

Microsoft Word/Excel/PowerPoint

Windows/Linux OS

Applications Engineer experience

technical presentations/demos

Education

MSEE/BSEE

Tools

Cadence APD/SiP

Siemens Xpedition/i3DL

Cadence OrbitIO/ISP

Synopsys 3DIC Compiler

Excel

Job description

Siemens EDA is seeking an Applications Engineer to support consultative sales in the US, focusing on IC packaging and 3DIC solutions. You will deliver technical presentations, run product demos, and help architect prototype flows to integrate Siemens EDA tools into customer designs.

The role requires 4+ years in IC package/layout design, familiarity with Verilog/LEF/DEF/GDS, and travel up to domestic and international locations.