3D-IC Application Engineer

Siemens EDA (Siemens Digital Industries Software); Fremont (CA); Hybrid; USD 120,000 - 180,000; Full time

Job summary

Siemens EDA (Siemens Digital Industries Software) is seeking an Applications engineer to support consultative sales with technical wins using Innovator 3D IC Layout and related tools. You will present, demonstrate, and benchmark products, while helping architect 3DIC solution flows and integration scripts for key accounts across the US.

International travel may be required. The role requires MSEE/BSEE with 4+ years in IC package/interposer design, strong scripting ability, and familiarity with

Qualifications

• MSEE/BSEE with 4+ years design experience.
• Experience in IC Package Design (Cadence APD/SiP, Siemens Xpedition/i3DL).
• Package design tools experience from setup to manufacturing docs.
• Familiarity with Package/Interposer planning solutions (XSI/i3DI, OrbitIO/ISP, 3DIC Compiler, Excel).
• 2.5D/3D chiplet design knowledge (TSMC InFO, CoWoS, EMIB, etc.).
• Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS).
• Signal/power integrity tools knowledge (HyperLynx, Sigrity, SIWave, ADS).
• Calibre DRC/LVS experience is valuable; MS Office & scripting basics.
• Windows and Linux OS familiarity; prior Applications Engineer experience preferred.

Responsibilities

• Deliver technical presentations and product demonstrations.
• Benchmark, prototype and develop flows integrating Siemens tools with customers.
• Develop solutions and account strategies to drive market share gains.
• Assist in architecting 3DIC flows and integration scripts.
• Travel domestically and internationally as needed.

Skills

IC Package Design

Package Design Tools

IC Data Formats

3DIC / 2.5D Design

Scripting / Programming

Calibre DRC/LVS

Windows and Linux OS

Applications Engineer experience

Education

MSEE/BSEE

Tools

Xpedition/i3DL

XSI/i3DI

OrbitIO/ISP

3DIC Compiler

Excel

Job description

As an Applications engineer with Siemens EDA Technology Solutions Sales, you will support consultative sales efforts at the world’s leading semiconductor and electronic equipment manufacturers. You will be responsible for technical wins with the industry leading solutions Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, and other product families. Responsible activities will include delivery of technical presentations, conducting product demonstrations and benchmarks, and participation in development of solutions and account strategies leading to market share gains for Siemens. This position is also expected to help architect and prototype Siemens EDA’s emerging 3DIC solution through the development of flows and integration scripts to link tools into a solution. Your territory coverage consists of Key Accounts located throughout the US. You will be responsible for integrating with peers located all over the world, communicating essential status to a variety of stakeholders and influential customers. International travel may be required.

Job Qualifications

MSEE/BSEE with 4+ years design experience. Significant experience in advanced IC Package layout design and/or interposer layout design. Experience with IC design is a plus. Necessary technical skills include satisfying many of these areas:

• Knowledge of IC Package Design (Cadence APD/SiP, Siemens Xpedition/i3DL) is required.
• Practical experience with Package design tools from design setup (stackup/constraints/etc), to implementation (routing/outgassing/re-use/etc), through generation of manufacturing documents is required.
• Familiarity with Package / Interposer planning solutions (Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Excel) is preferred.
• Familiarity with 2.5D and 3D chiplet-based design solutions (TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, etc.) is preferred.
• Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS, etc.) is desired.
• Familiarity with signal/power integrity tools (HyperLynx, Sigrity, SIWave, ADS, etc) and analysis flows is preferred
• Experience with Siemens Calibre DRC, LVS, and/or 3DSTACK solutions is highly desirable.
• Above average competency with Microsoft Word, Excel, and PowerPoint.
• Scripting/Programming: VBS, Python, Tcl, Perl, or similar languages.
• Working OS knowledge of Windows and Linux.
• Prior experience as an Applications Engineer is preferred.

The ideal candidate will:

• Possess a passion to learn and perform at the cutting edge of technology.
• Have a desire to broaden exposure to the business aspects of the technical design world.
• Enjoy contributing to the success of a great team.
• Be able to work independently with minimal supervision.
• Effectively influence people at any level.
• Enjoy helping and motivating others to be successful.
• Demonstrated ability to build strong rapport and credibility with customer organizations while maintaining a company internal network of contacts.
• Be willing to travel domestically and internationally.

Why us?

Working at Siemens Software means flexibility - Choosing between working at home and the office at other times is the norm here. We offer great benefits and rewards, as you'd expect from a world leader in industrial software. A collection of over 377,000 minds building the future one day at a time in over 200 countries. We're dedicated to equality, and we welcome applications that reflect the diversity of the communities we work in. All employment decisions at Siemens are based on qualifications, merit, and business need. Bring your curiosity and creativity and help us shape tomorrow!

Siemens Software.

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