3D-IC Applications Engineer - Drive 3DIC Design Wins

ISU Research Park; Ames (IA); On-site; USD 110,000 - 160,000; Full time

Job summary

Siemens EDA is seeking an Applications Engineer to support consultative sales across the U.S., including travel to major accounts. You will drive technical design wins for Innovator 3D IC Layout, Xpedition, Calibre, and related tools by delivering presentations, demos and benchmarks, and by shaping solutions with account teams.

The ideal candidate holds an MSEE/BSEE with 4+ years of design experience in IC package or interposer layout, is proficient with Cadence/Xpedition and Siemens tools, and

Qualifications

• MSEE/BSEE with 4+ years design experience.
• Experience in advanced IC package layout and/or interposer layout.
• Experience with IC design is a plus.
• Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS).
• Familiarity with signal/power integrity tools (HyperLynx, Sigrity, SIWave, ADS).
• Working OS knowledge of Windows and Linux.

Responsibilities

• Deliver technical presentations and conduct product demonstrations and benchmarks.
• Develop solutions and account strategies to win design-in opportunities.
• Prototype flows and integration scripts for 3DIC solutions.
• Collaborate with global peers and travel domestically and internationally to engage customers.

Skills

IC package design

2.5D/3D chiplet design

Xpedition/i3DL

3DIC flow prototyping

Wi ndows/Linux proficiency

Communication skills

Travel willingness

Education

MSEE/BSEE

Tools

Cadence APD/SiP

Siemens Xpedition/i3DL

Cadence OrbitIO/ISP

Synopsys 3DIC Compiler

Excel

Job description

Siemens EDA is seeking an Applications Engineer to support consultative sales across the U.S., including travel to major accounts. You will drive technical design wins for Innovator 3D IC Layout, Xpedition, Calibre, and related tools by delivering presentations, demos and benchmarks, and by shaping solutions with account teams.

The ideal candidate holds an MSEE/BSEE with 4+ years of design experience in IC package or interposer layout, is proficient with Cadence/Xpedition and Siemens tools, and