3D-IC Application Engineer

ISU Research Park; Ames (IA); On-site; USD 110,000 - 160,000; Full time

Job summary

Siemens EDA is seeking an Applications Engineer to support consultative sales across the U.S., including travel to major accounts. You will drive technical design wins for Innovator 3D IC Layout, Xpedition, Calibre, and related tools by delivering presentations, demos and benchmarks, and by shaping solutions with account teams.

The ideal candidate holds an MSEE/BSEE with 4+ years of design experience in IC package or interposer layout, is proficient with Cadence/Xpedition and Siemens tools, and

Qualifications

• MSEE/BSEE with 4+ years design experience.
• Experience in advanced IC package layout and/or interposer layout.
• Experience with IC design is a plus.
• Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS).
• Familiarity with signal/power integrity tools (HyperLynx, Sigrity, SIWave, ADS).
• Working OS knowledge of Windows and Linux.

Responsibilities

• Deliver technical presentations and conduct product demonstrations and benchmarks.
• Develop solutions and account strategies to win design-in opportunities.
• Prototype flows and integration scripts for 3DIC solutions.
• Collaborate with global peers and travel domestically and internationally to engage customers.

Skills

IC package design

2.5D/3D chiplet design

Xpedition/i3DL

3DIC flow prototyping

Wi ndows/Linux proficiency

Communication skills

Travel willingness

Education

MSEE/BSEE

Tools

Cadence APD/SiP

Siemens Xpedition/i3DL

Cadence OrbitIO/ISP

Synopsys 3DIC Compiler

Excel

Job description

As an Applications engineer with Siemens EDA Technology Solutions Sales, you will support consultative sales efforts at the world’s leading semiconductor and electronic equipment manufacturers.

As an Applications Engineer at Siemens EDA, your primary responsibility is to secure technical design wins for Siemens EDA's product and service offerings. Specifically, you will be responsible for technical wins with the industry leading solutions Innovator 3D IC Layout, Innovator3D IC Integrator, Xpedition, Calibre, HyperLynx, and other product families. Responsible activities will include delivery of technical presentations, conducting product demonstrations and benchmarks, and participation in development of solutions and account strategies leading to market share gains for Siemens. This position is also expected to help architect and prototype Siemens EDA’s emerging 3DIC solution through the development of flows and integration scripts to link tools into a solution.

Your territory coverage consists of Key Accounts located throughout the US. You will be responsible for integrating with peers located all over the world, communicating essential status to a variety of stakeholders and influential customers. International travel may be required.

Job Qualifications

MSEE/BSEE with 4+ years design experience. Significant experience in advanced IC Package layout design and/or interposer layout design. Experience with IC design is a plus. Necessary technical skills include satisfying many of these areas:

• Knowledge of IC Package Design (Cadence APD/SiP, Siemens Xpedition/i3DL) is required.
• Practical experience with Package design tools from design setup (stackup/constraints/etc), to implementation (routing/outgassing/re-use/etc), through generation of manufacturing documents is required.
• Familiarity with Package / Interposer planning solutions (Siemens XSI/i3DI, Cadence OrbitIO/ISP, Synopsys 3DIC Compiler, Excel) is preferred.
• Familiarity with 2.5D and 3D chiplet-based design solutions (TSMC InFO, CoWoS, Intel EMIB, Foveros, ASE FoCUS, Amkor SWIFT, Samsung I/H/X-Cube, etc.) is preferred.
• Knowledge of IC data formats (Verilog, LEF/DEF, GDS, OASIS, etc.) is desired.
• Familiarity with signal/power integrity tools (HyperLynx, Sigrity, SIWave, ADS, etc) and analysis flows is preferred
• Experience with Siemens Calibre DRC, LVS, and/or 3DSTACK solutions is highly desirable.
• Above average competency with Microsoft Word, Excel, and PowerPoint.
• Working OS knowledge of Windows and Linux.
• Prior experience as an Applications Engineer is preferred.

The ideal candidate will:

• Possess a passion to learn and perform at the cutting edge of technology.
• Have a desire to broaden exposure to the business aspects of the technical design world.
• Enjoy contributing to the success of a great team.
• Be able to work independently with minimal supervision.
• Effectively influence people at any level.
• Enjoy helping and motivating others to be successful.
• Demonstrated ability to build strong rapport and credibility with customer organizations while maintaining a company internal network of contacts.
• Be willing to travel domestically and internationally.