Substrate IC Package Designer — High-Speed Interposers

black.ai; Tempe (AZ); On-site; USD 130,000 - 160,000; Full time

Benefits offered by this job

Early-stage equity opportunities

401(k) potential

Health, dental, and vision coverage

Professional Growth – rapid expansion

Annual company event in Australia

Flexible leave policies

15 days PTO and 10 days sick leave

Job summary

Syenta, in Tempe, is seeking a senior substrate IC package designer to lead large-format interposers and high-density layouts that enable advanced packaging architectures for high-performance processors. You will drive signal integrity and power integrity, coordinating with process, materials and hardware teams to align designs with fabrication capabilities.

The role requires deep expertise in high-speed signal design and mastery of Allegro Package Designer, with opportunities to shape internal

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
• 5+ years of experience in substrate IC package design for high-performance processors or accelerators.
• Extensive experience designing large-format substrate packages (>50mm) with complex, high-density layouts.
• Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches.
• Advanced proficiency in Allegro Package Designer (constraint management, routing, and design verification).
• Strong understanding of SI/PI principles and their application to package-level design.
• Solid foundational knowledge across electrical, materials, thermal, and/or mechanical engineering disciplines.
• Working knowledge of substrate manufacturing processes, design rules, and material properties.

Responsibilities

• Design large (>50mm), complex multi-layer substrate interposers with high pin counts and dense routing requirements.
• Develop high-speed signal routing solutions capable of supporting >50GHz performance while minimizing signal integrity issues such as loss and crosstalk.
• Ensure robust signal integrity (SI) and power integrity (PI) across all designs.
• Optimize designs for thermal performance and reliability.
• DRC and LVS verification for all substrate designs; maintain detailed design documentation and reusable guidelines.
• Collaborate with global, cross-functional teams to ensure design feasibility and manufacturability.
• Partner with process, materials, and hardware teams to align design with fabrication capabilities and constraints.
• Contribute to internal best practices for substrate and interposer design and help build capability.

Skills

High-speed signal design

Signal integrity

Cross-functional collaboration

Power integrity

Problem solving

Education

Bachelor’s or Master’s degree in Electrical Engineering or related field

Tools

Valor CAM350

Calibre

Allegro Package Designer

Job description

Syenta, in Tempe, is seeking a senior substrate IC package designer to lead large-format interposers and high-density layouts that enable advanced packaging architectures for high-performance processors. You will drive signal integrity and power integrity, coordinating with process, materials and hardware teams to align designs with fabrication capabilities.

The role requires deep expertise in high-speed signal design and mastery of Allegro Package Designer, with opportunities to shape internal