Advanced IC Packaging Engineer

Jobtailor; Chandler (AZ); On-site; USD 150,000 - 230,000; Full time

Job summary

Jobtailor is seeking an experienced packaging expert to lead end-to-end development of advanced IC packaging solutions. You will design and deliver 2.5D/3D packaging with power-delivery chiplets, integrating them into substrate cores, while coordinating with OSATs and suppliers.

The role covers concept through high-volume manufacturing, with a strong emphasis on DoE, data analysis, and reliability testing. You will apply your expertise in power delivery, SI, and package-system co-design to drive

Qualifications

• Advanced degree or higher in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• 8+ years in semiconductor packaging with deep expertise in advanced packaging (2.5D/3D, chiplets, substrate integration).
• Experience taking packaging tech from concept to production with process and product qualification.
• Strong background in power delivery, SI, and package-system co-design.
• Hands-on DoE methodology, statistical analysis, and process optimization in manufacturing or R&D.
• Deep expertise in failure analysis and corrective actions across domains.
• Knowledge of soldering, interconnect reliability, and defect mechanisms.
• Experience collaborating with OSATs, testing, and supply chain ecosystems.
• Ability to operate in ambiguity and make high-quality technical decisions with limited data.

Responsibilities

• Develop end-to-end advanced IC packaging solutions integrating power delivery chiplets into substrates.
• Architect land-side assembly and embedded chiplet integration within cores.
• Build packaging technologies from concept through high-volume manufacturing (HVM).
• Establish and optimize DoE frameworks to accelerate development and yield improvements.
• Develop statistical models to guide design decisions, process control, and yield.

Skills

2.5D/3D packaging

Chiplets integration

Power delivery design

Signal integrity

DoE and statistical analysis

Failure analysis

OSAT collaboration

Process qualification

Data-driven decision making

Ambiguity tolerance

Education

MS/PhD in EE, Materials Science, or ME

Job description

• Responsible for the end-to-end development of advanced IC packaging solutions integrating power delivery chiplets into package substrates.
• Architect and deliver first-of-its-kind land-side assembly and embedded chiplet integration within substrate cores.
• Build packaging technologies from concept through high-volume manufacturing (HVM), including design, materials, process, test and reliability.
• Establish and optimize Design of Experiments (DoE) frameworks to accelerate process development, yield learning, and performance optimization.
• Develop statistical models and apply rigorous data analysis to drive design decisions, process control, and yield improvement.
• Drive assembly process development, including novel flows for chiplet integration, substrate embedding, advanced interconnects and structure for reliability tests.
• Partner directly with hyperscalers, ASIC, GPU, and xPU customers to integrate power delivery chiplets into their platforms.
• Work closely with OSATs, testing, substrate vendors, and materials suppliers to build scalable, manufacturable solutions.

Requirements

• Advanced degree (MS/PhD preferred) in Electrical Engineering, Materials Science, Mechanical Engineering, or related field.
• 8+ years of experience in semiconductor packaging with deep expertise in advanced packaging (2.5D/3D, chiplets, substrate integration, test, reliability).
• Proven experience taking packaging technologies from early concept to production including process and product qualification.
• Strong background in power delivery, signal/power integrity, and package-system co-design.
• Hands-on experience with DoE methodology, statistical analysis, and process optimization in a manufacturing or R&D environment.
• Deep expertise in failure analysis, including root cause identification and corrective action across multiple domains.
• Strong understanding of soldering processes, interconnect reliability, and assembly defect mechanisms.
• Experience working with external manufacturing partners (OSATs), testing and supply chain ecosystems.
• Ability to operate in ambiguity, move fast, and make high-quality technical decisions with limited data.