Senior Substrate IC & Packaging Design Engineer

ProFound People; Tempe (AZ); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Company equity

Benefits

Job summary

ProFound People is seeking a high-impact engineer to help develop precision manufacturing processes for next-generation micro-scale technologies. You will play a key role in shaping next-generation packaging architectures and high-performance chip-to-chip integration solutions.

The ideal candidate will have multi-year experience in substrate IC package design, strong background in advanced packaging architectures, and proficiency with Allegro Package Designer for constraint management and

Qualifications

• Multiple years of experience in substrate IC package design.
• Strong experience in advanced packaging architectures.
• Proficiency with Allegro Package Designer (constraint management, routing).
• Deep understanding of SI/PI principles at package level.

Responsibilities

• Develop precision manufacturing processes for next-generation micro-scale technologies.
• Shape next-generation packaging architectures, including high-performance chip-to-chip integration.

Skills

substrate IC package design

advanced packaging architectures

SI/PI principles

Tools

Allegro Package Designer

Job description

ProFound People is seeking a high-impact engineer to help develop precision manufacturing processes for next-generation micro-scale technologies. You will play a key role in shaping next-generation packaging architectures and high-performance chip-to-chip integration solutions.

The ideal candidate will have multi-year experience in substrate IC package design, strong background in advanced packaging architectures, and proficiency with Allegro Package Designer for constraint management and