Staff Signal Integrity Architect for AI Superchips

Arm

San Jose (CA)

Vor Ort

USD 209.000 - 283.000

Vollzeit

Vor 2 Tagen
Sei unter den ersten Bewerbenden

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Zusammenfassung

Arm is seeking a Staff Signal Integrity Engineer to lead design, modeling, and validation of high-speed interconnects for next-generation AI superchips and data-center platforms. The role spans silicon, advanced packaging, PCB, and system-level interconnects to ensure robust electrical performance and signaling reliability.

You will drive channel analysis for DDR5/LPDDR, PCIe/CXL, Ethernet, and SerDes, develop EM and IBIS models, and collaborate across teams to achieve design-for-sign-off.

Qualifikationen

  • BS/MS/PhD in Electrical Engineering or related field.
  • 8+ years in high-speed SI engineering, semiconductor packaging, or system-level electrical design.

Aufgaben

  • Drive SI design, modeling, simulation, and validation across SoC, packaging, PCB, and system interconnects.
  • Perform high-speed channel analysis and optimization for DDR5/LPDDR, PCIe/CXL, Ethernet, D2D, and SerDes interfaces.
  • Develop and validate EM, S-parameter, IBIS/IBIS-AMI, and behavioral models for chip-to-chip and chip-to-memory interfaces.
  • Lead SI optimization including insertion loss, return loss, crosstalk, impedance discontinuities, equalization, and BER-based eye-margin analysis.
  • Collaborate with silicon PHY, package, PCB, architecture, and validation teams to drive SI design guidelines and SI-to-silicon correlation.
  • Support advanced packaging technologies including chiplets, interposers, high-density substrates, and heterogeneous integration.

Kenntnisse

High-speed SI
SI design
3D electromagnetic modeling
Analytical problem-solving

Ausbildung

BS/MS/PhD in Electrical Engineering

Tools

Ansys HFSS
SIwave
Keysight ADS

Jobbeschreibung

Arm is seeking a Staff Signal Integrity Engineer to lead design, modeling, and validation of high-speed interconnects for next-generation AI superchips and data-center platforms. The role spans silicon, advanced packaging, PCB, and system-level interconnects to ensure robust electrical performance and signaling reliability.

You will drive channel analysis for DDR5/LPDDR, PCIe/CXL, Ethernet, and SerDes, develop EM and IBIS models, and collaborate across teams to achieve design-for-sign-off.

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