sr pkg engineer san jose ca

ESR Healthcare; San Jose (CA); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

401K

Bonus

Stock/Equity

Full Premium Healthcare

Job summary

A semiconductor startup is looking for a Sr Package Engineer in San Jose, CA. This exciting role involves working on mechanical designs for advanced electronic packaging and optical components. Applicants should have a B.S. or M.S. in a relevant engineering field and be proficient in Solidworks. Experience with FEA, as well as knowledge of packaging standards is essential. The position comes with benefits including a 401K, bonuses, and full premium healthcare.

Qualifications

• B.S. or M.S. in Mechanical Engineering, Electrical Engineering, Material Engineering.
• Knowledge of Solidworks or other design packages.
• Experience with FEA using Ansys or Abaqus.
• Background in 2.5D/3D packaging and TSV.

Responsibilities

• Work on mechanical designs for advanced electronic packaging.
• Involve in strain, thermal, and structural analysis.
• Apply knowledge of packaging standards.

Skills

Mechanical Engineering

Electrical Engineering

Material Engineering

Solidworks

Finite Element Analysis (FEA)

Thermal Analysis

Structural Analysis

Strain Analysis

Packaging Standards

Through-Silicon Via (TSV)

Education

B.S. or M.S. in Mechanical/Electrical/Material Engineering

Tools

Solidworks

Ansys

Abaqus

Job description

sr pkg engineer san jose ca

Overview

This is an exciting opportunity to work with a semiconductor startup that has raised over $100m in funding and is rapidly growing. This role involves working on mechanical designs for advanced electronic packaging and optical components.

Essential Skills

• B.S. or M.S. in Mechanical Engineering, Electrical Engineering, Material Engineering etc.
• Knowledge of Solidworks (or other design packages) to create packaging designs
• Knowledge of FEA (Finite Element Analysis) with Ansys or Abaqus etc.
• Experience working on Thermal, Structural or Strain analysis
• Knowledge of packaging standards including JEDEC
• Has previously worked on 2.5D or 3D Packaging
• Experience with Through-Silicon Via (TSV)

Company Benefits

• 401K
• Bonus
• Stock/Equity
• Full Premium Healthcare