Staff Engineer, Advanced SiP Packaging & Simulation

El Camino Health; City of Syracuse (NY); On-site; USD 101,000 - 178,000; Full time

Benefits offered by this job

Medical

Dental

Vision

401k

Flexible spending and health savings

Accident benefits

Life insurance

Disability benefits

Paid vacation & holidays

Job summary

TTM Technologies, Inc. in the United States seeks a Staff Engineer – Microelectronics Packaging Technology to lead design and analysis of highly integrated SiP packages.

You will create 3D designs, run thermal and mechanical simulations, and collaborate with RF, MW, electrical teams to advance packaging concepts from concept to manufacturing readiness. You will use SOLIDWORKS for detailed designs and ANSYS for FEM analyses, evaluate materials and interconnects, and contribute to building

Qualifications

• Bachelor’s degree in mechanical engineering with materials coursework.
• Master’s degree is a plus for advanced roles.
• 9+ years of relevant experience in semiconductor packaging development.

Responsibilities

• Lead the design and development of advanced SiPs and module package solutions using 2D/3D packaging technologies with 50 micron to 130 micron flip-chip interconnects, WLP bumped die, and embedded die.
• Provide technical leadership in support of package architecture selection by generating 3D package designs, manufacturability, and risk assessments.
• Generate and optimize detailed package designs in 3D environment using SOLIDWORKS in collaboration with RF/MW/electrical engineering teams.
• Perform complex physics-based mechanical and vibration simulations for SiP configurations using FEM tools (ANSYS).
• Perform SiP-level thermal simulations for microelectronics packages using FEM tools (ANSYS).
• Define and assist in the buildup of SiP design infrastructure including package design flows, 3D modeling and simulation methodologies.
• Lead or assist in writing white papers, technical proposals, and conference publications.
• Benchmark industry best practices and evaluate emerging technologies for package design, assembly materials, and process innovations.

Skills

3D modeling

SiP packaging knowledge

Thermal/structural analysis

Cross-functional collaboration

Communication

Packaging design

Education

Bachelor’s degree in mechanical engineering

Master’s degree (plus)

Tools

SOLIDWORKS

ANSYS

Job description

TTM Technologies, Inc. in the United States seeks a Staff Engineer – Microelectronics Packaging Technology to lead design and analysis of highly integrated SiP packages.

You will create 3D designs, run thermal and mechanical simulations, and collaborate with RF, MW, electrical teams to advance packaging concepts from concept to manufacturing readiness. You will use SOLIDWORKS for detailed designs and ANSYS for FEM analyses, evaluate materials and interconnects, and contribute to building