Staff Engineer, SiP & Microelectronics Packaging

TTM Technologies, Inc.

City of Syracuse (NY)

On-site

USD 101,000 - 178,000

Full time

4 days ago

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Job summary

TTM Technologies, Inc. is seeking a Staff Engineer - Microelectronics Packaging Technology to join our advanced technology team.

You will design and layout highly integrated SiP packages, analyze thermal and mechanical behavior, and support the development of SiP design infrastructure across aerospace, defense, and industrial applications. You will lead 3D package designs in SOLIDWORKS, perform FEM simulations in ANSYS, evaluate manufacturability, and contribute to white papers and proposals

Qualifications

Bachelor's degree in mechanical engineering
9+ years of relevant experience
Experience with SiP packaging and 2D/3D integration

Responsibilities

Lead design and development of advanced SiPs and module package solutions using 2D/3D packaging technologies with 50micron to 130micron flip-chip interconnects, WLP bumped die, and embedded die
Provide technical leadership in support of package architecture selection by generating 3D package designs, manufacturability, and risk assessments
Generate and optimize detailed package designs in 3D environment using SOLIDWORKS, collaborating with RF/MW/electrical engineering teams
Perform complex physics-based mechanical and vibration simulations for SiP configurations using FEM tools (ANSYS) to analyze chip-package interaction, package-board interaction, warpage, stress, and reliability risks
Perform SiP-level thermal simulations for microelectronics packages using FEM tools (ANSYS)
Define and assist in the buildup of SiP design infrastructure that includes package design flows, 3D modeling and simulation methodologies, generating package design rules
Lead or assist in writing white papers, technical proposals, and conference publications
Benchmark industry best practices and evaluate emerging technologies for package design, assembly materials, and process innovations
Perform and collate tradeoff analysis on ambiguous problems that considers interdisciplinary nature of semiconductor packages
Communicate complex technical concepts effectively to cross-functional project teams, operations, suppliers, business teams
Be creative in designing and developing innovative integration methods that foster differentiation and IP generation
Assist in project management by providing planning inputs for defining packaging tasks, schedule, and cost