Senior Mechanical Engineer, Electronic Packaging & FEA Lead

TTM Technologies; City of Syracuse (NY); On-site; USD 101,000 - 178,000; Full time

Benefits offered by this job

Health benefits

401k matching

Paid vacation & holidays

Shift premium

Job summary

TTM Technologies, Inc. is seeking an experienced Mechanical Engineer to design, analyze and qualify electronics packaging for commercial, defense and space products. You will lead mechanical design efforts, perform FEA and thermal analyses, and collaborate across engineering teams.

Responsibilities include evaluating design trade-offs, developing qualification plans, and mentoring junior staff while ensuring customer requirements are met and standards are followed.

Qualifications

• Bachelor degree in Mechanical Engineering or equivalent.
• Minimum 10 years of relevant experience in mechanical design and electronics packaging.

Responsibilities

• Address undefined or ambiguous problems with deep technical knowledge.
• Perform FEA on next generation development projects.
• Develop advanced concepts and technologies for products.
• Analyze and recommend design concepts to meet customer requirements.
• Prepare and participate in internal and external design reviews.
• Mentor and supervise engineers and designers.

Skills

3D Modeling

FEA

Thermal Analysis

Leadership

Cross-functional Collaboration

Communication

GD&T

Education

Bachelor of Science Degree - Mechanical Engineering

Tools

ANSYS

SolidWorks Simulation

MatLab

MathCad

LabVIEW

Job description

TTM Technologies, Inc. is seeking an experienced Mechanical Engineer to design, analyze and qualify electronics packaging for commercial, defense and space products. You will lead mechanical design efforts, perform FEA and thermal analyses, and collaborate across engineering teams.

Responsibilities include evaluating design trade-offs, developing qualification plans, and mentoring junior staff while ensuring customer requirements are met and standards are followed.