Staff Engineer – Advanced SiP Packaging & Thermal Design

TTM Technologies, Inc.; City of Syracuse (NY); On-site; USD 101,000 - 178,000; Full time

Benefits offered by this job

Health insurance

401k

Paid time off

Job summary

TTM Technologies, Inc. seeks a Staff Engineer – Microelectronics Packaging Technology to advance SiP and module sub-systems for aerospace, defense, and industrial applications.

You will develop heterogeneous SiP packages, analyze mechanical and thermal behavior, and support infrastructure for design and testing, collaborating across manufacturing, operations, and suppliers. You will lead 3D packaging design activities, evaluate manufacturability, and contribute to white papers and technical

Qualifications

• :Bachelor’s degree in mechanical engineering (materials coursework) required.
• :Minimum 9+ years relevant experience in semiconductor packaging development.
• :6-7 years hands-on semiconductor packaging development experience.

Responsibilities

• :Lead design and development of advanced SiPs and module package solutions using 2D/3D packaging technologies.
• :Generate 3D package designs and assess manufacturability and risk.
• :Perform 3D modeling and simulations in a 3D environment with SolidWorks and ANSYS.
• :Conduct mechanical and thermal FEM simulations for SiP configurations.
• :Define SiP design infrastructure and packaging design rules.
• :Assist in writing white papers, proposals, and publications.
• :Benchmark industry practices and evaluate emerging technologies.

Skills

3D modeling

FEA analysis

Thermal simulations

Vibration simulations

Package design optimization

SOLIDWORKS

ANSYS

Education

Bachelor’s degree in mechanical engineering

Master’s degree preferred

Tools

SOLIDWORKS

ANSYS

Job description

TTM Technologies, Inc. seeks a Staff Engineer – Microelectronics Packaging Technology to advance SiP and module sub-systems for aerospace, defense, and industrial applications.

You will develop heterogeneous SiP packages, analyze mechanical and thermal behavior, and support infrastructure for design and testing, collaborating across manufacturing, operations, and suppliers. You will lead 3D packaging design activities, evaluate manufacturability, and contribute to white papers and technical