Staff Engineer, Advanced IC Packaging & Reliability

Analog Devices, Inc.; Wilmington (MA); Hybrid; USD 113,000 - 164,000; Full time

Benefits offered by this job

Medical insurance

Vision insurance

Dental insurance

401(k)

Paid vacation

Job summary

Analog Devices, Inc. seeks an experienced Packaging Engineer to lead advanced packaging development across multiple market segments.

You will drive mechanical and thermal analyses, coordinate with OSATs and suppliers, and guide design guidelines and simulations to ensure reliability, manufacturability, and cost targets. You will contribute to wire-bond, flip-chip, and system-in-package solutions, applying FEM tools to assess risks and optimize performances.

Qualifications

• PhD or Master’s degree in Mechanical or Electrical Engineering.
• 5+ years of hands-on semiconductor packaging experience.
• Strong understanding of IC packaging materials and mechanics.
• Experience with FEM tools; ANSYS preferred.
• Familiar with FloTHERM, Sigrity, or Icepak is a plus.

Responsibilities

• Lead the design, development, and qualification of semiconductor packaging solutions including wire-bond, flip-chip, and SIP modules.
• Provide technical leadership in package mechanical and thermal analysis for architecture selection and reliability risk assessment.
• Perform mechanical simulations of IC packages and systems to evaluate chip-package interaction and warpage.
• Perform component- and system-level thermal simulations for semiconductor packages.
• Collaborate with cross-functional teams to meet packaging requirements and resolve issues.
• Work with OSATs, substrate suppliers, and vendors to drive process development and improve yield.
• Develop and maintain package design guidelines, specifications, and documentation.

Skills

Packaging development

Package simulation

Packaging manufacturing

Analytical skills

Cross-functional collaboration

Education

PhD or Master’s in Mechanical/Electrical Engineering

Tools

ANSYS

FloTHERM

Sigrity

Icepak

Cadence Allegro

Job description

Analog Devices, Inc. seeks an experienced Packaging Engineer to lead advanced packaging development across multiple market segments.

You will drive mechanical and thermal analyses, coordinate with OSATs and suppliers, and guide design guidelines and simulations to ensure reliability, manufacturability, and cost targets. You will contribute to wire-bond, flip-chip, and system-in-package solutions, applying FEM tools to assess risks and optimize performances.