Staff Engineer, Semi Packaging Engineering

Analog Devices; Wilmington (MA); On-site; USD 113,000 - 164,000; Full time

Benefits offered by this job

Discretionary bonus

Medical, vision and dental coverage

401k

Paid vacation, holidays, and sick time

Other benefits

Job summary

Analog Devices, Inc. is seeking a senior-level packaging engineering professional to lead design, development, and qualification of advanced semiconductor packaging solutions.

The role focuses on wire-bond, flip-chip, and system-in-package platforms, with mechanical and thermal analysis guiding architecture choices and reliability planning. You will perform FEM simulations, collaborate with OSATs and suppliers, and drive process improvements to optimize yield and cost while maintaining robust

Qualifications

• PhD or Master’s in Mechanical or Electrical Engineering.
• 5+ years of hands-on semiconductor packaging experience.
• Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
• Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
• Hands-on experience with major FEM tools; ANSYS experience preferred.
• Experience with FloTHERM, Sigrity, or Icepak is a plus.
• Experience with Cadence Allegro is a plus.
• Strong analytical, problem-solving, communication, and collaboration skills.

Responsibilities

• Lead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
• Provide technical leadership in package mechanical and thermal analysis to support package architecture selection, design optimization, and reliability risk assessment.
• Perform mechanical simulations of IC packages and systems using FEM tools to evaluate chip-package interaction, package-board interaction, warpage, stress, and reliability risks.
• Perform component- and system-level thermal simulations for semiconductor packages using commercial simulation tools.
• Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
• Collaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
• Work with quality and reliability teams to establish reliability criteria and qualification plans for semiconductor products across various market applications.
• Develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.

Skills

Analytical thinking

Problem solving

Communication

Collaboration

Education

PhD or Master’s in Mechanical or Electrical Engineering

Tools

ANSYS

FloTHERM

Sigrity

Icepak

Cadence Allegro

Job description

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

Job Description

This role will be responsible for the development of advanced packaging solutions for semiconductor devices across various market segments. The packaging solutions must meet demanding product requirements while balancing reliability, manufacturability, and cost.

Candidates will be expected to:

• Lead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
• Provide technical leadership in package mechanical and thermal analysis to support package architecture selection, design optimization, and reliability risk assessment.
• Perform mechanical simulations of IC packages and systems using FEM tools to evaluate chip-package interaction, package-board interaction, warpage, stress, and reliability risks.
• Perform component- and system-level thermal simulations for semiconductor packages using commercial simulation tools.
• Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
• Collaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
• Work with quality and reliability teams to establish reliability criteria and qualification plans for semiconductor products across various market applications.
• Develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.

Qualifications

• PhD or Master's degree in Mechanical Engineering or Electrical Engineering.
• 5+ years of hands‑on experience in semiconductor packaging development, package simulation, or packaging manufacturing.
• Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
• Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
• Hands‑on experience with major FEM tools; ANSYS experience is preferred.
• Experience with FloTHERM, Sigrity, or Icepak is a plus.
• Experience with Cadence Allegro is a plus.
• Strong analytical, problem-solving, communication, and collaboration skills.
• Ability to work effectively in cross-functional teams and influence technical decisions across organizations.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group. EEO is the Law: Notice of Applicant Rights Under the Law.

Job Req Type

Experienced

Travel

Yes, 10% of the time

Shift Type

1st Shift/Days

Expected Wage Range

$113,190 to $163,905

Benefits

• Discretionary performance-based bonus based on personal and company factors.
• Medical, vision and dental coverage.
• 401k.
• Paid vacation, holidays, and sick time.
• Other benefits.

Company Overview (duplicate)

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. Come join ADI - a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare. ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future.