SiP Layout Design Engineer – Flip-Chip & SiP Packaging Expert

1010 Analog Devices Inc.; Wilmington (MA); On-site; USD 117,000 - 161,000; Full time

Benefits offered by this job

Discretionary bonus

Medical, vision, and dental

401k

Paid vacation

Holidays

Sick time

Job summary

Analog Devices, Inc. in the United States seeks an experienced SiP layout design engineer with strong laminate and PCB layout expertise for advanced packaging applications.

You will support flip-chip packages, SiP products, and module-based solutions across multiple market segments, collaborating with IC, package and product engineering teams to ensure designs meet specifications and reliability goals.

Qualifications

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or a related technical field.
• 5+ years of hands-on experience in laminate, substrate, PCB, or advanced package layout design.
• Strong knowledge of laminate, substrate, and PCB layout principles including routing, stack-up design, impedance control, creepage/clearance, and manufacturability constraints.

Responsibilities

• Develop laminate, substrate, interposer, and PCB layout designs for flip-chip packages, SiP products, and module-based semiconductor solutions.
• Design and optimize routing, power and ground planes, via structures, escape routing, interconnect schemes, and substrate stack-ups to meet electrical, thermal, mechanical, and reliability requirements.
• Work closely with IC design, package engineering, and product engineering teams to ensure layout designs meet product specifications and package requirements.
• Perform design rule checks, layout verification, and design reviews to ensure compliance with package, substrate, PCB, and assembly design rules.
• Support layout feasibility studies, floor planning, package architecture selection, and design trade-off analysis for new package concepts.
• Generate and maintain layout databases, design documentation, fabrication drawings, stack-up drawings, and design review materials.
• Manage multiple layout projects, develop realistic layout schedules, track progress, and communicate status, risks, and issues to cross-functional teams.

Skills

Cadence Allegro

PCB layout

Laminate design

Package layout

Impedance control

Education

Bachelor's degree in Electrical Engineering

Tools

CAD software

Job description

Analog Devices, Inc. in the United States seeks an experienced SiP layout design engineer with strong laminate and PCB layout expertise for advanced packaging applications.

You will support flip-chip packages, SiP products, and module-based solutions across multiple market segments, collaborating with IC, package and product engineering teams to ensure designs meet specifications and reliability goals.