Staff Engineer, Semi Packaging Engineering

Analog Devices, Inc.; Wilmington (MA); Hybrid; USD 113,000 - 164,000; Full time

Benefits offered by this job

Medical insurance

Vision insurance

Dental insurance

401(k)

Paid vacation

Job summary

Analog Devices, Inc. seeks an experienced Packaging Engineer to lead advanced packaging development across multiple market segments.

You will drive mechanical and thermal analyses, coordinate with OSATs and suppliers, and guide design guidelines and simulations to ensure reliability, manufacturability, and cost targets. You will contribute to wire-bond, flip-chip, and system-in-package solutions, applying FEM tools to assess risks and optimize performances.

Qualifications

• PhD or Master’s degree in Mechanical or Electrical Engineering.
• 5+ years of hands-on semiconductor packaging experience.
• Strong understanding of IC packaging materials and mechanics.
• Experience with FEM tools; ANSYS preferred.
• Familiar with FloTHERM, Sigrity, or Icepak is a plus.

Responsibilities

• Lead the design, development, and qualification of semiconductor packaging solutions including wire-bond, flip-chip, and SIP modules.
• Provide technical leadership in package mechanical and thermal analysis for architecture selection and reliability risk assessment.
• Perform mechanical simulations of IC packages and systems to evaluate chip-package interaction and warpage.
• Perform component- and system-level thermal simulations for semiconductor packages.
• Collaborate with cross-functional teams to meet packaging requirements and resolve issues.
• Work with OSATs, substrate suppliers, and vendors to drive process development and improve yield.
• Develop and maintain package design guidelines, specifications, and documentation.

Skills

Packaging development

Package simulation

Packaging manufacturing

Analytical skills

Cross-functional collaboration

Education

PhD or Master’s in Mechanical/Electrical Engineering

Tools

ANSYS

FloTHERM

Sigrity

Icepak

Cadence Allegro

Job description

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

Position Overview

This role will be responsible for the development of advanced packaging solutions for semiconductor devices across various market segments. The packaging solutions must meet demanding product requirements while balancing reliability, manufacturability, and cost.

Role Responsibilities

• Lead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
• Provide technical leadership in package mechanical and thermal analysis to support package architecture selection, design optimization, and reliability risk assessment.
• Perform mechanical simulations of IC packages and systems using FEM tools to evaluate chip-package interaction, package-board interaction, warpage, stress, and reliability risks.
• Perform component- and system-level thermal simulations for semiconductor packages using commercial simulation tools.
• Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
• Collaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
• Work with quality and reliability teams to establish reliability criteria and qualification plans for semiconductor products across various market applications.
• Develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.

Qualifications

• PhD or Master’s degree in Mechanical Engineering or Electrical Engineering.
• 5+ years of hands‑on experience in semiconductor packaging development, package simulation, or packaging manufacturing.
• Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
• Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
• Hands‑on experience with major FEM tools; ANSYS experience is preferred.
• Experience with FloTHERM, Sigrity, or Icepak is a plus.
• Experience with Cadence Allegro is a plus.
• Strong analytical, problem‑solving, communication, and collaboration skills.
• Ability to work effectively in cross‑functional teams and influence technical decisions across organizations.

Export Licensing

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Equal Opportunity & Inclusion

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group. EEO is the Law: Notice of Applicant Rights Under the Law.

Job Type & Travel

Job Req Type: Experienced. Required Travel: Yes, 10% of the time. Shift Type: 1st Shift/Days.

Compensation & Benefits

• Expected wage range for a new hire into this position is $113,190 to $163,905. Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.

Additional Company Overview

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X. Come join ADI – a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare. ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future.