Semiconductor Packaging Engineer — Design & Reliability

Analog Devices; Wilmington (MA); On-site; USD 75,000 - 103,000; Full time

Benefits offered by this job

Medical, Vision & Dental

401k

Paid time off

Bonus opportunity

Job summary

Analog Devices, Inc. in Wilmington, MA, is seeking an experienced packaging engineer to lead the design, development, and qualification of advanced semiconductor packaging solutions, including wire-bond, flip-chip, SIP modules, and module-based products.

You will collaborate with OSAT partners, substrates, and vendors to resolve issues, perform mechanical and thermal analyses, and ensure reliability, manufacturability, and cost targets across multiple market segments.

Qualifications

• Master's degree in Mechanical or Electrical Engineering.
• 2+ years in semiconductor packaging development or related fields.
• Strong knowledge of IC packaging materials, mechanics, and thermal behavior.
• Experience with package structures, substrate tech, and assembly processes.

Responsibilities

• Lead design, development, and qualification of packaging solutions (wire-bond, flip-chip, SIP).
• Provide mechanical/thermal analysis to guide architecture and reliability risk assessment.
• Collaborate with cross-functional teams to meet product and packaging needs.
• Partner with OSATs, substrates, and vendors to improve yield and process development.
• Work with quality teams to establish reliability criteria and qualification plans.
• Develop and maintain design guidelines, specs, and documentation.

Skills

Semiconductor packaging

Package simulation

Cross-functional teamwork

Mechanical design concepts

Reliability analysis

Education

Master's degree in Mechanical Engineering or Electrical Engineering

Tools

ANSYS

FloTHERM

Sigrity

Icepak

SolidWorks

AutoCAD

Job description

Analog Devices, Inc. in Wilmington, MA, is seeking an experienced packaging engineer to lead the design, development, and qualification of advanced semiconductor packaging solutions, including wire-bond, flip-chip, SIP modules, and module-based products.

You will collaborate with OSAT partners, substrates, and vendors to resolve issues, perform mechanical and thermal analyses, and ensure reliability, manufacturability, and cost targets across multiple market segments.