Silicon Photonics & Optical Packaging Eng

Apple; United States; On-site; USD 120,000 - 180,000; Full time

Job summary

Apple is seeking a hardworking Si photonics & optical packaging engineer to join our team in the United States. You will develop Si photonics engine/chiplet packaging and co-packaging solutions, defining assembly baseline processes and BOMs, and optimizing optical coupling design for performance, reliability, yield and cost.

The role requires leading packaging technology development, collaborating with cross-functional teams, vendors, foundries, and OSAT to bring packaging solutions from concept

Qualifications

• BS and 3+ years of relevant industry experience.
• Strong theoretical background in optics and photonics fundamentals.
• Hands-on packaging and measuring fiber-coupled devices.
• Experience with optical component design, simulation and qualification, and single/multi-mode fiber assembly.

Responsibilities

• Lead Si photonics packaging technology development and co-packaging efforts.
• Define assembly baseline processes and package BOM; establish optical coupling design/manufacturing.
• Collaborate with optical component vendors, foundry and OSAT to bring packaging solutions from concept to high-volume manufacturing.

Skills

Optics fundamentals

Device integration

Active alignment

Fiber coupling

Simulation tools

CMOS BEOL

CoC/CoW/WLP

Cross-functional collaboration

Communication skills

Education

Bachelor's degree

Job description

Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to realize high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost.

Responsible to lead Si photonics packaging technology development. Work with cross functional team and lead optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts. Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM. Minimum 5% International travel.

Minimum Qualifications

BS and 3+ years of relevant industry experience.

Preferred Qualifications

• M.S or Ph.D. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired, preferred.
• Excellent teamwork and communication skills.
• Strong theoretical background in optics and photonics fundamentals, device/module integration.
• Hands-on experience in packaging and measuring fiber-coupled devices.
• Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool.
• Min. 5 years works experiences in the related field with M.S and or Ph.D.
• Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, …)
• Experience with silicon photonics device laser, modulator, PD, passive components, such as, Si WG, MUX/DeMUX is a plus.