Senior Silicon Photonics Packaging Engineer

Apple Inc.; San Francisco (CA); On-site; USD 185,000 - 325,000; Full time

Job summary

Apple Inc. in the San Francisco Bay Area is seeking a Silicon Photonics & Optical Packaging Engineer to lead the development of Si photonics engine packaging and co-packaging solutions.

You will define assembly baseline processes, establish optical coupling designs, and drive packaging that optimizes performance, reliability, yield and cost, with minimum 5% international travel. The role involves collaborating with vendors, foundries, and OSATs to bring packaging solutions from concept to

Qualifications

• BS and 10+ years of relevant industry experience.
• Strong teamwork and communication skills preferred.
• Solid theoretical background in optics and photonics fundamentals.
• Hands-on experience in packaging and measuring fiber-coupled devices.

Responsibilities

• Design and model silicon photonic devices and optical interconnects, optimizing coupling, thermal, and signal integrity performance.
• Develop and simulate optical packaging architectures integrating photonic chips, fibers, and electronics using tools like Lumerical, Zemax, or COMSOL.
• Prototype and characterize integrated photonic packages, correlating simulation with optical and electrical measurements.
• Collaborate with cross-functional teams (process, electrical, mechanical, reliability) to enable scalable, manufacturable designs.
• Document results and present technical findings through reports, reviews, or relevant forum presentations contributing to next-generation optical I/O development.

Skills

Teamwork

Communication

Optics fundamentals

Photonic integration

Education

BS in relevant field

Tools

Lumerical

Zemax

COMSOL

Job description

Apple Inc. in the San Francisco Bay Area is seeking a Silicon Photonics & Optical Packaging Engineer to lead the development of Si photonics engine packaging and co-packaging solutions.

You will define assembly baseline processes, establish optical coupling designs, and drive packaging that optimizes performance, reliability, yield and cost, with minimum 5% international travel. The role involves collaborating with vendors, foundries, and OSATs to bring packaging solutions from concept to