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Nokia is seeking a Silicon Photonics Packaging Co-op for Spring 2027 to contribute to R&D of silicon photonics transceiver modules. You will develop packaging processes, design packages with cross-functional teams, and ensure manufacturing compliance while performing mechanical and thermal analyses.
Ideal candidates are MS/PhD students in EE/Physics, with experience in 2.5D/3D packaging and advanced packaging methods. This is an onsite role in Sunnyvale, CA for 4 months.
Nokia is seeking a Silicon Photonics Packaging Co-op for Spring 2027 to contribute to R&D of silicon photonics transceiver modules. You will develop packaging processes, design packages with cross-functional teams, and ensure manufacturing compliance while performing mechanical and thermal analyses.
Ideal candidates are MS/PhD students in EE/Physics, with experience in 2.5D/3D packaging and advanced packaging methods. This is an onsite role in Sunnyvale, CA for 4 months.