Silicon Photonics Packaging Co-op — Sunnyvale Spring 2027

NOKIA

New York (NY)

In loco

USD 45.000 - 56.000

Part-time

10 giorni fa

Una candidatura completa in un minuto

Curriculum e lettera di presentazione personalizzati, pronti da inviare.

Supera i filtri ATS

Descrizione del lavoro

Nokia is seeking a Silicon Photonics Packaging Co-op for Spring 2027 to contribute to R&D of silicon photonics transceiver modules. You will develop packaging processes, design packages with cross-functional teams, and ensure manufacturing compliance while performing mechanical and thermal analyses.

Ideal candidates are MS/PhD students in EE/Physics, with experience in 2.5D/3D packaging and advanced packaging methods. This is an onsite role in Sunnyvale, CA for 4 months.

Competenze

  • Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA.

Mansioni

  • Develop semiconductor and optical packaging processes in-house or with contract manufacturers.
  • Design optical transceiver packages in collaboration with cross-functional teams to meet package requirements.
  • Own Design Rules documents and ensure Design for Manufacturing specifications are met.
  • Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
  • Drive package debug activities during product validation and qualification.
  • Plan and drive prototype assembly builds for early design validation.
  • Apply advanced packaging principles and stay current with new tech advancements.

Conoscenze

Packaging design
DFM (design for manufacturing)
Thermal analysis
2.5D/3D packaging
Cross-functional collaboration
Vendor interaction

Formazione

MS or PhD student in EE/Physics/Applied Physics (USA)

Strumenti

ANSYS
SEM/XSEM
Confocal microscopy
Acoustic imaging

Descrizione del lavoro

Nokia is seeking a Silicon Photonics Packaging Co-op for Spring 2027 to contribute to R&D of silicon photonics transceiver modules. You will develop packaging processes, design packages with cross-functional teams, and ensure manufacturing compliance while performing mechanical and thermal analyses.

Ideal candidates are MS/PhD students in EE/Physics, with experience in 2.5D/3D packaging and advanced packaging methods. This is an onsite role in Sunnyvale, CA for 4 months.

Ottieni la revisione del curriculum gratis e riservata.

o trascina qui il file.

Similar jobs

Offerte di lavoro simili che vale la pena confrontare

Silicon Photonics Packaging Engineer Co-op
Silicon Photonics Packaging Engineer Co-op

NOKIA • New York (NY)

In loco
USD 45.000 - 56.000
Silicon Photonics Packaging Engineer Co-op
Silicon Photonics Packaging Engineer Co-op

NOKIA • Sunnyvale (CA)

In loco
USD 47.000 - 58.000
Lead Silicon Photonics Packaging Engineer
Lead Silicon Photonics Packaging Engineer

NOKIA • Sunnyvale (CA)

In loco
USD 100.000 - 130.000
Silicon Photonics Packaging Intern: 3D Co-Packaged Optics
Silicon Photonics Packaging Intern: 3D Co-Packaged Optics

GlobalFoundries inc. • New York (NY)

In loco
USD 28.000 - 55.000
Mentorship
Professional development
Networking with executives
Silicon Photonics Test Co-op (4 Months, NYC)
Silicon Photonics Test Co-op (4 Months, NYC)

NOKIA • New York (NY)

In loco
USD 12.000 - 18.000
Summer Silicon Photonics Packaging Intern
Summer Silicon Photonics Packaging Intern

GlobalFoundries inc. • Town of Malta (NY)

In loco
USD 28.000 - 55.000
Mechanical Packaging Engineer Co-op
Mechanical Packaging Engineer Co-op

NOKIA • New York (NY)

In loco
USD 22.000 - 36.000
Senior Packaging Development Engineer
Senior Packaging Development Engineer

NOKIA • Sunnyvale (CA)

In loco
USD 100.000 - 130.000
Lead Silicon Photonics Design Engineer for Coherent Optics
Lead Silicon Photonics Design Engineer for Coherent Optics

NOKIA • New York (NY)

In loco
USD 180.000 - 240.000
Silicon Photonics & Optical Packaging Eng
Silicon Photonics & Optical Packaging Eng

Apple • Stati Uniti

In loco
USD 120.000 - 180.000