Mechanical Packaging Engineer Co-op

NOKIA; New York (NY); Presencial; USD 22.000 - 36.000; Jornada completa

Descripción de la vacante

Nokia is seeking a 4-month onsite internship in Sunnyvale, CA or New York, NY for MS/PhD students in mechanical engineering or related fields. You will perform mechanical integrity and thermal simulations, support packaging components, and develop manufacturing drawings using 3D CAD tools.

Applicants should have 3D CAD and GD&T experience, DFx knowledge, and strong communication skills to collaborate with engineers and vendors.

Formación

• Current MS/PhD student in mechanical engineering, physics, or related field.
• Experience with 3D CAD, tolerance analysis, and GD&T.
• Knowledge of Design for Manufacturing (DFx).
• Strong communication and problem-solving skills.

Responsabilidades

• Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
• Support advanced packaging components and test fixtures for new products using 3D software and generate manufacturing drawings.
• Apply in-depth knowledge of Design for Manufacturing principles and stay current with new technological advancements.
• Drive package debug activities during product validation and qualification.

Conocimientos

3D CAD

Tolerance analysis

GD&T

SolidWorks

Thermal simulation

Thermo-mechanical

ANSYS

Documentation

Interpersonal skills

Vendor collaboration

Educación

MS/PhD student

Herramientas

SolidWorks

ANSYS

3D CAD tools

Descripción del empleo

Number of Positions: 1

Date: Jan 2027 - Apr 2027

Duration: 4 months

Location: Onsite in Sunnyvale, CA or New York, NY

EDUCATIONAL RECOMMENDATIONS

Current M.S. or Ph.D. student in mechanical engineering, physics, or other similar fields or related field with an accredited school in US.

• Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
• Support advanced packaging components and test fixtures for new products using 3D software and generate manufacturing drawings.
• Apply in-depth knowledge of Design for Manufacturing principles and stay current with new technological advancements.
• Drive package debug activities during product validation and qualification.

• Experience with 3D CAD design, tolerance analysis, and GD&T with SolidWorks or similar software.
• Experience with thermal and thermo-mechanical simulations using ANSYS or similar software.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.

It would be nice if you also had:

• Knowledge of design for manufacturing of 2.5D/3D packaging.
• Experience in high-speed electronics package design and/or laser package design.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience.
• Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.

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Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.