Silicon Photonics Packaging Engineer Co-op

NOKIA; Sunnyvale (CA); In loco; USD 47.000 - 58.000; Tempo pieno

Descrizione del lavoro

Nokia is seeking a Silicon Photonics Packaging Co-op for Spring 2027 in Sunnyvale, CA. The role focuses on research and development of silicon photonics transceiver modules and packaging processes.

You will collaborate with cross-functional teams to meet package requirements, drive prototyping, and ensure DFM specs are met while applying advanced packaging principles and simulations.

Competenze

• Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA.
• Experience with package and process design/development from design to production.
• Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
• Experience with documentation of fabrication, inspection, and assembly processes.

Mansioni

• Develop semiconductor and optical packaging processes in-house, or with contract manufacturers.
• Design optical transceiver packages in collaboration with cross-functional teams to ensure package requirements are met.
• Own Design Rules documents and ensure Design for Manufacturing specifications are met.
• Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
• Drive package debug activities during product validation and qualification.
• Plan and drive prototype assembly builds to enable deliveries for early design validation.
• Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.

Conoscenze

Packaging design

Thermal analysis

DFM knowledge

Cross-functional teamwork

Formazione

MS/PhD student in EE/Physics

Strumenti

ANSYS

SEM

XSEM

Descrizione del lavoro

Number of Positions: 2
Duration: 4 months
Date: January 2027-June 2027
Location: Onsite in Sunnyvale, CA,

Education Recommendations

Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA.

We are searching for a Silicon Photonics Packaging Co-op for our Spring 2027 Term to engage in the research and development of silicon photonics transceiver modules.

• Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
• Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
• Own Design Rules documents and ensure Design for Manufacturing specifications are met.
• Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
• Drive package debug activities during product validation and qualification.
• Plan and Drive prototype assembly builds to enable deliveries for early design validation.
• Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.

• Experience with package and process design/development from design to production.
• Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.

It would be nice if you also had:

• Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages.
• Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
• Experience in high-speed electronics package design and/or laser package design.
• Experience with thermo-mechanical simulations using ANSYS or similar software.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
• Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.

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Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you're interested in this role but don't meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.