Silicon Photonics Packaging Engineer Co-op

NOKIA; New York (NY); In loco; USD 45.000 - 56.000; Part-time

Descrizione del lavoro

Nokia is seeking a Silicon Photonics Packaging Co-op for Spring 2027 to contribute to R&D of silicon photonics transceiver modules. You will develop packaging processes, design packages with cross-functional teams, and ensure manufacturing compliance while performing mechanical and thermal analyses.

Ideal candidates are MS/PhD students in EE/Physics, with experience in 2.5D/3D packaging and advanced packaging methods. This is an onsite role in Sunnyvale, CA for 4 months.

Competenze

• Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA.

Mansioni

• Develop semiconductor and optical packaging processes in-house or with contract manufacturers.
• Design optical transceiver packages in collaboration with cross-functional teams to meet package requirements.
• Own Design Rules documents and ensure Design for Manufacturing specifications are met.
• Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
• Drive package debug activities during product validation and qualification.
• Plan and drive prototype assembly builds for early design validation.
• Apply advanced packaging principles and stay current with new tech advancements.

Conoscenze

Packaging design

DFM (design for manufacturing)

Thermal analysis

2.5D/3D packaging

Cross-functional collaboration

Vendor interaction

Formazione

MS or PhD student in EE/Physics/Applied Physics (USA)

Strumenti

ANSYS

SEM/XSEM

Confocal microscopy

Acoustic imaging

Descrizione del lavoro

Number of Positions: 2
Duration: 4 months
Date: January 2027-June 2027
Location: Onsite in Sunnyvale, CA,

Education Recommendations

Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA.

We are searching for a Silicon Photonics Packaging Co-op for our Spring 2027 Term to engage in the research and development of silicon photonics transceiver modules.

• Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
• Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
• Own Design Rules documents and ensure Design for Manufacturing specifications are met.
• Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
• Drive package debug activities during product validation and qualification.
• Plan and Drive prototype assembly builds to enable deliveries for early design validation.
• Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.

• Experience with package and process design/development from design to production.
• Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.

It would be nice if you also had:

• Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages.
• Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
• Experience in high-speed electronics package design and/or laser package design.
• Experience with thermo-mechanical simulations using ANSYS or similar software.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
• Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.

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Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you're interested in this role but don't meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.