DRAM Process Integration Engineer: Yield & AI-Driven Innovation

Micron Technology, Inc; Boise (ID); On-site; USD 100,000 - 150,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Income protection programs

Paid family leave

Paid time off

Job summary

Micron Technology, Inc. in Boise, Idaho seeks a Semiconductor Process Engineer 2 to advance DRAM fabrication and yield—driving process improvements across CMP, film, etch, and lithography steps.

You will analyze inline data, collaborate with Device/YE/Process/QA teams, and apply AI tools for problem solving. A MS in engineering is required, relocation TBD, with full-time responsibilities in a manufacturing setting.

Qualifications

• Knowledge of semiconductor process flows and yield-driven analysis.
• Experience with CMP, film, etch, and photolithography processes.
• Understanding of memory technologies (DRAM, NAND, NOR).
• Ability to analyze data statistically for process improvements.
• Strong communication and self-motivation for cross-functional work.

Responsibilities

• Enable next generation DRAM in the manufacturing Fab and ramp up production yield.
• Analyze electrical and inline data to identify yield detractors and process anomalies.
• Optimize integration flow and structure to improve yield and performance.
• Monitor and maintain the production line ensuring c-spec and structure integrity.
• Collaborate with cross-functional teams to drive continuous improvement.
• Leverage AI tools to improve problem solving and productivity.
• Communicate results to large audiences.

Skills

Semiconductor process flow

CMP knowledge

Etch processes

Memory technologies

Statistical data analysis

Communication skills

Education

M.S. in Electrical Engineering

M.S. in Materials Engineering

M.S. in Chemical Engineering

Tools

Programming languages

AI tools

Software tools

Job description

Micron Technology, Inc. in Boise, Idaho seeks a Semiconductor Process Engineer 2 to advance DRAM fabrication and yield—driving process improvements across CMP, film, etch, and lithography steps.

You will analyze inline data, collaborate with Device/YE/Process/QA teams, and apply AI tools for problem solving. A MS in engineering is required, relocation TBD, with full-time responsibilities in a manufacturing setting.