MEMS Substrate Process Engineer: Wafer Bonding & Alignment

Atomica; Goleta, Northern (CA, KY); Hybrid; USD 90,000 - 140,000; Full time

Job summary

Atomica, a U.S.-based MEMS and AI hardware microfabrication foundry, seeks a Substrate Process Engineer with wafer bonding and high-precision alignment expertise to join our MEMS team. You will develop and sustain bonding and alignment processes, collaborating with R&D and production in a cleanroom environment to enable reliable backend processing.

Based in Santa Barbara, enjoy a coastal paradise while contributing to scalable prototyping and production.

Qualifications

• Bachelor of Science or Master of Science in Engineering (Materials, Chemical, Electrical, Mechanical, or related).
• 3+ years experience in semiconductor or MEMS fabrication.
• Hands-on experience in at least two of: wafer bonding, wet etching, electroplating, CMP/wafer thinning, or dicing.

Responsibilities

• Develop and maintain wafer bonding processes (eutectic, thermocompression, direct, adhesive).
• Wet etch processes (Si, oxide, metals) including rate and uniformity control.
• Support electroplating processes (Au, Cu, Ni, NiFe, AuSn).
• Support Dicing, CMP, wafer grinding processes.
• Improve yield, reduce defects, and optimize process stability.
• Perform DOE, root cause analysis, and SPC monitoring.
• Support equipment qualification and uptime.
• Work closely with R&D, production, and quality teams.

Skills

Wafer bonding

Wet etching

Electroplating

CMP/wafer thinning

Dicing

Education

B.S. or M.S. in Engineering

Job description

Atomica, a U.S.-based MEMS and AI hardware microfabrication foundry, seeks a Substrate Process Engineer with wafer bonding and high-precision alignment expertise to join our MEMS team. You will develop and sustain bonding and alignment processes, collaborating with R&D and production in a cleanroom environment to enable reliable backend processing.

Based in Santa Barbara, enjoy a coastal paradise while contributing to scalable prototyping and production.