Senior Thin-Film Engineer, Advanced Packaging & R&D

Micron Technology; Boise (ID); On-site; USD 120,000 - 170,000; Full time

Benefits offered by this job

Medical plan

Dental plan

Vision plan

Income protection

Paid time off

Paid holidays

Job summary

Micron Technology is seeking an experienced Process Engineer in Boise, Idaho, specializing in thin film deposition for Advanced Packaging R&D. You will develop and optimize deposition processes, collaborating with process integration, yield, and equipment teams to translate ideas into manufacturing-ready solutions.

Requirements include an MS/PhD in a related field and 7+ years in advanced packaging with thin film deposition; strong data analysis, DOE, thermodynamics, and kinetics knowledge; plus

Qualifications

• MS or PhD in Materials Science, Chemical Engineering, Chemistry, Physics or related field.
• 7+ years in Advanced Packaging with thin film deposition and characterization.
• Strong data analysis, DOE and statistical techniques.
• Knowledge of thermodynamics and kinetics applicable to film deposition.
• Analytical and creative problem-solving with solid technical knowledge.

Responsibilities

• Develop, optimize, and characterize thin film processes for advanced packaging products.
• Collaborate with process integration and other development teams on innovative solutions.
• Optimize deposition processes to reduce cost, variability, and emissions.
• Perform root-cause analysis and engage vendors for solutions.
• Maintain a technology development pilot manufacturing line.
• Support process transfer to production facilities; some travel may be required.

Skills

Thin films

Process engineering

Data analysis

DOE

Thermodynamics

Problem solving

Statistical methods

Education

MS/PhD in Materials Science

Tools

Programming/Scripting

Automation

AI tools

Job description

Micron Technology is seeking an experienced Process Engineer in Boise, Idaho, specializing in thin film deposition for Advanced Packaging R&D. You will develop and optimize deposition processes, collaborating with process integration, yield, and equipment teams to translate ideas into manufacturing-ready solutions.

Requirements include an MS/PhD in a related field and 7+ years in advanced packaging with thin film deposition; strong data analysis, DOE, thermodynamics, and kinetics knowledge; plus