Principal Thin-Film Engineer, Advanced Packaging

Micron; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical coverage

Dental coverage

Vision coverage

Paid time off

Paid holidays

Disability insurance

Retirement plan

Job summary

Micron Technology is seeking an experienced Process Engineer specialized in thin film deposition for Advanced Packaging R&D. You’ll drive development from concept to manufacturing, partnering with process integration, yield, and equipment teams to deliver robust deposition solutions for next‑gen memory products.

The role emphasizes solving complex film challenges, optimizing processes, and contributing to intellectual property and technology roadmaps within a fast-paced, collaborative

Qualifications

• MS or PhD in Materials Science, Chemical Engineering, Chemistry, Physics or related field.
• 7+ years in Advanced Packaging with thin film deposition and characterization.
• Experience with growth and characterization of thin films.
• Proficiency in data analysis, DOE, and statistical techniques.

Responsibilities

• Develop, optimize, and characterize thin film processes to meet requirements of advanced packaging products.
• Collaborate with process integration and other development teams to create innovative solutions.
• Optimize deposition processes to reduce cost, variability, and emissions while improving process capability.
• Perform root cause and failure mode analysis to understand hardware limitations and engage vendors.
• Maintain a technology development pilot manufacturing line.
• Support process transfer to production facilities; some travel may be required.

Skills

Thin film deposition

Data analysis

DOE

Statistical techniques

Thermodynamics

Chemical kinetics

Analytical problem solving

Education

MS or PhD in Materials Science, Chemical Engineering, Chemistry, Physics

Job description

Micron Technology is seeking an experienced Process Engineer specialized in thin film deposition for Advanced Packaging R&D. You’ll drive development from concept to manufacturing, partnering with process integration, yield, and equipment teams to deliver robust deposition solutions for next‑gen memory products.

The role emphasizes solving complex film challenges, optimizing processes, and contributing to intellectual property and technology roadmaps within a fast-paced, collaborative