Senior Thin‑Film Engineer, Advanced Packaging

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 170,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off and holidays

Income protection programs

Job summary

Micron Technology, Inc. is seeking an experienced Process Engineer with expertise in depositing thin films to advance next-generation memory solutions.

You will develop, optimize, and implement robust deposition processes from concept to production within the Advanced Packaging Technology Development (APTD) team. The role requires deep knowledge of thin films, strong data analysis skills, and collaboration with process integration, failure analysis, and manufacturing groups to drive IP and

Qualifications

• MS or PhD in Materials Science, Chemical Engineering, Physics, or related field.
• 7+ years of industry experience in Advanced Packaging with specialization in thin film deposition and characterization.
• Strong understanding of growth and characterization of thin films.

Responsibilities

• Develop, optimize, and characterize thin film processes to meet requirements of advanced packaging products.
• Collaborate with process integration and other teams to develop innovative solutions.
• Optimize deposition processes to reduce cost, variability, and emissions; improve process capability.
• Conduct root cause and failure mode analysis and engage vendors for solutions.
• Maintain a technology development pilot manufacturing line.
• Support process transfer to production facilities (some travel).

Skills

Thin film deposition

Data analysis

DOE

Statistical methods

Thermodynamics

Chemical kinetics

Problem solving

Education

MS or PhD in Materials Science / Chemical Engineering / Physics

Job description

Micron Technology, Inc. is seeking an experienced Process Engineer with expertise in depositing thin films to advance next-generation memory solutions.

You will develop, optimize, and implement robust deposition processes from concept to production within the Advanced Packaging Technology Development (APTD) team. The role requires deep knowledge of thin films, strong data analysis skills, and collaboration with process integration, failure analysis, and manufacturing groups to drive IP and