Advanced DRAM Thin Films Process Engineer

Micron Technology, Inc; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc in Boise, Idaho, is seeking a R&D Thin Films Process Development Engineer for Advanced DRAM. This role owns dielectric deposition processes and collaborates across integration, equipment, and operations to deliver robust, scalable solutions for high‑yield devices.

Ideal candidates have 5+ years in semiconductor thin‑film deposition, hands‑on deposition and troubleshooting, and knowledge of ALD, epitaxy or plasma‑based methods.

Qualifications

• Masters degree with 2+ years experience in Physics, Chemistry, Chemical Engineering, Materials Science or related field OR PhD with relevant industry experience.
• Hands-on experience with thin-film deposition and process troubleshooting.
• Working knowledge of ALD, epitaxy, or plasma-based deposition fundamentals.
• Experience using data-driven methods such as DOE, SPC, and basic materials characterization.
• Ability to work independently and clearly communicate technical results.

Responsibilities

• Drive development and maturity of thin-film deposition processes for High Aspect Ratio Advanced DRAM features and devices.
• Collaborate with integration, equipment, and operations to deliver robust, scalable solutions.
• Lead cross-functional teams to influence technical and strategic decisions and track project milestones.

Skills

Thin-film deposition

Deposition troubleshooting

ALD / epitaxy / plasma basics

Data-driven methods (DOE, SPC)

Independent communication of results

AI / coding / automation in process

Cross-functional teamwork

Education

Master’s degree + 2+ years

PhD with relevant industry

Job description

Micron Technology, Inc in Boise, Idaho, is seeking a R&D Thin Films Process Development Engineer for Advanced DRAM. This role owns dielectric deposition processes and collaborates across integration, equipment, and operations to deliver robust, scalable solutions for high‑yield devices.

Ideal candidates have 5+ years in semiconductor thin‑film deposition, hands‑on deposition and troubleshooting, and knowledge of ALD, epitaxy or plasma‑based methods.