Senior Thin-Film Architect, Advanced Packaging

Micron Technology, Inc.; Boise (ID); On-site; USD 140,000 - 190,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho is seeking a Principal Thin Films Engineer for Advanced Packaging. You will lead development and optimization of thin film deposition processes for next-generation memory products, taking ideas from concept through pilot to production.

The role requires deep SME in thin films and 7+ years in Advanced Packaging, with data analysis/DOE and collaboration across process integration, failure analysis, yield, and equipment vendors. Some travel may be required.

Qualifications

• MS or PhD in Materials Science, Chemical Engineering, Chemistry, Physics, or related technical field.
• 7+ years in Advanced Packaging with thin film deposition & characterization.
• Proficiency with data analysis, DOE, and statistical techniques.
• Knowledge of thermodynamics & chemical kinetics in film deposition.
• Strong analytical & creative problem-solving skills.

Responsibilities

• Develop, optimize, and characterize thin film processes for advanced packaging products.
• Collaborate with process integration and other teams to develop innovative solutions.
• Optimize deposition processes to reduce cost, variability, and emissions; improve process capability.
• Conduct root cause and failure mode analysis; engage vendors for solutions.
• Maintain a technology development pilot manufacturing line.
• Support process transfer to production facilities; some travel may be required.

Skills

Thin film deposition

Data analysis, DOE, statistics

Thermodynamics & kinetics

Analytical thinking

Plasma processing

Programming/scripting/automation

AI agents

Education

MS or PhD in Materials Science / Chemical Engineering / Chemistry / Physics

Tools

None

Job description

Micron Technology, Inc. in Boise, Idaho is seeking a Principal Thin Films Engineer for Advanced Packaging. You will lead development and optimization of thin film deposition processes for next-generation memory products, taking ideas from concept through pilot to production.

The role requires deep SME in thin films and 7+ years in Advanced Packaging, with data analysis/DOE and collaboration across process integration, failure analysis, yield, and equipment vendors. Some travel may be required.