Dielectric Thin-Film Process Engineer - R&D

Micron Technology, Inc; Boise (ID); Hybrid; USD 90,000 - 150,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho, is seeking a PhD- or Masters- level R&D Thin Films Process Development Engineer focused on dielectric deposition to advance Advanced DRAM devices.

You will own key deposition processes, partner with integration and equipment teams, and work hands-on with state-of-the-art tools to drive robust, scalable solutions meeting performance and yield goals. The role requires strong data-driven problem solving and cross-functional collaboration.

Qualifications

• Hands-on experience with thin-film deposition and process troubleshooting.
• Working knowledge of ALD, epitaxy, or plasma-based deposition fundamentals.
• Experience using data-driven methods such as DOE and SPC, and basic materials characterization.

Responsibilities

• Technically innovate: drive decisions at project and platform level for thin films deposition.
• Operationally relate wafer performance to hardware performance and improve film metrics.
• Lead cross-functional initiatives to meet technical and KPI targets.
• Communicate status and plans effectively to leadership with a focus on fundamentals.

Skills

Thin-film deposition

ALD

Epitaxy

Data-driven methods (DOE)

SPC

Education

Master’s degree in Physics, Chemistry, Chemical Engineering, Materials Science, or related field

PhD with relevant industry experience

Tools

DOE

Job description

Micron Technology, Inc. in Boise, Idaho, is seeking a PhD- or Masters- level R&D Thin Films Process Development Engineer focused on dielectric deposition to advance Advanced DRAM devices.

You will own key deposition processes, partner with integration and equipment teams, and work hands-on with state-of-the-art tools to drive robust, scalable solutions meeting performance and yield goals. The role requires strong data-driven problem solving and cross-functional collaboration.