Senior Thin-Film Process Development Engineer (DRAM)

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 120,000 - 160,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off & holidays

Job summary

Micron Technology in Boise, ID seeks an Experienced R&D Thin Films Process Development Engineer for Advanced DRAM. You will lead critical process engineering initiatives across thin film deposition, addressing high aspect ratio, high density devices, and new product introductions.

Collaborate with cross-functional teams to diagnose issues, validate baselines, scale tools, and drive yield, cost, and reliability improvements.

Qualifications

• PhD/Master/Bachelor in Engineering or related field, or equivalent practical experience.
• Hands-on experience with failure analysis, FMEA, SPC/FDC or similar methodologies.
• Experience collaborating with cross-functional teams to resolve production issues.

Responsibilities

• Diagnose and resolve thin films deposition process issues using structured methodologies (failure analysis, FMEA, 8D, SPC/FDC).
• Lead process, equipment, and material evaluations; implement improvements at the process step level.
• Drive yield improvement, cost reduction, and productivity initiatives across manufacturing lines.

Skills

Failure analysis

FMEA

SPC/FDC

Data analysis

Cross-functional collaboration

Education

Engineering degree (PhD/Master/Bachelor)

Tools

APC

RMS

Automated process control

Job description

Micron Technology in Boise, ID seeks an Experienced R&D Thin Films Process Development Engineer for Advanced DRAM. You will lead critical process engineering initiatives across thin film deposition, addressing high aspect ratio, high density devices, and new product introductions.

Collaborate with cross-functional teams to diagnose issues, validate baselines, scale tools, and drive yield, cost, and reliability improvements.