Senior Packaging Engineer, AI Accelerator Packaging

Amazon Inc.; Austin (TX); On-site; USD 185,000 - 250,000; Full time

Benefits offered by this job

Health insurance

401(k) matching

Paid time off

RSUs

Job summary

Annapurna Labs, part of Amazon, is building advanced Trainium packaging technologies at Tempe and Austin. You will drive cross‑functional development across architecture, materials, and assembly to enable scalable production of next‑gen AI accelerators.

You will partner with OSATs and suppliers, balance performance and cost, and guide design reviews with silicon, board and supply chain teams. A strong background in packaging technology is essential.

Qualifications

• Bachelor's degree in Materials Science, mechanical, electrical or chemical engineering or 10+ years of industry experience in a related field.
• Expertise in substrate/PCB, interposer, or package and board assembly technology.
• Experience coordinating between technical teams, peers and business stakeholders.
• Track record driving technology development from concept through qualification.

Responsibilities

• Define and drive package technology development across architecture, design, materials, processes, yield, warpage, reliability, and system-level integration.
• Partner with OSATs and suppliers on validation, test vehicle development, qualification, FMEA, root-cause analysis and corrective actions.
• Evaluate tradeoffs across performance, cost, yield, manufacturability, warpage, thermal performance and reliability.
• Represent the team in cross-functional design reviews and program checkpoints with silicon, board, system, and supply chain teams.
• Identify opportunities for novel packaging architectures and process simplifications to reduce cost and accelerate time-to-market.

Skills

Cross-functional coordination

Package technology

System-level integration

Vendor and supplier collaboration

Education

Bachelor's in Materials Science or Mechanical/Electrical/Chemical Engineering

10+ years of industry experience in a related field

Tools

Substrate/PCB technology

Interposer technology

Package and board assembly technology

DFM for advanced packaging (HDI, microvias)

Job description

Annapurna Labs, part of Amazon, is building advanced Trainium packaging technologies at Tempe and Austin. You will drive cross‑functional development across architecture, materials, and assembly to enable scalable production of next‑gen AI accelerators.

You will partner with OSATs and suppliers, balance performance and cost, and guide design reviews with silicon, board and supply chain teams. A strong background in packaging technology is essential.