Senior Thermal Design Engineer – Power Semiconductors

Infineon Technologies AG; San Jose (CA); On-site; USD 150,000 - 190,000; Full time

Job summary

Infineon Technologies AG seeks a senior thermal/Mechanical Engineer to lead design of high-power thermal solutions, including IVR, VRM, and power module platforms. You will architect cooling with liquid systems, cold plates, manifolds, and TIM materials, and perform rigorous simulations.

You will mentor engineers, drive prototype builds, and align thermal performance with packaging constraints and reliability targets.

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering or related discipline; PhD is a plus.
• 8-10+ years of thermal/mechanical design experience in semiconductor, power electronics, or advanced electronics cooling.
• Expert proficiency in SolidWorks for 3D mechanical design.
• Deep knowledge of liquid cooling systems, including cold plates and manifolds.
• Experience designing heat sinks, vapor chambers, TIM interfaces, and package-level thermal solutions.
• Strong understanding of packaging constraints, reliability, and manufacturability.
• Ability to lead programs independently and communicate with executive and technical teams.

Responsibilities

• Lead thermal design and development of advanced semiconductor power solutions (IVR, VRM, modules).
• Architect thermal management using liquid cooling, cold plates, manifolds, heat sinks, and TIMs.
• Perform detailed thermal simulations (ANSYS Icepak, FloTHERM) and CFD methods.
• Develop and optimize mechanical designs using SolidWorks for thermal assemblies.
• Conduct steady-state and transient analysis to improve performance and manufacturability.
• Mentor junior engineers and lead thermal initiatives across programs.
• Influence product roadmap decisions related to thermal performance and system integration.

Job description

Infineon Technologies AG seeks a senior thermal/Mechanical Engineer to lead design of high-power thermal solutions, including IVR, VRM, and power module platforms. You will architect cooling with liquid systems, cold plates, manifolds, and TIM materials, and perform rigorous simulations.

You will mentor engineers, drive prototype builds, and align thermal performance with packaging constraints and reliability targets.