Thermal Design Engineer - Lead Principal

Infineon Technologies AG; San Jose (CA); On-site; USD 150,000 - 190,000; Full time

Job summary

Infineon Technologies AG seeks a senior thermal/Mechanical Engineer to lead design of high-power thermal solutions, including IVR, VRM, and power module platforms. You will architect cooling with liquid systems, cold plates, manifolds, and TIM materials, and perform rigorous simulations.

You will mentor engineers, drive prototype builds, and align thermal performance with packaging constraints and reliability targets.

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering or related discipline; PhD is a plus.
• 8-10+ years of thermal/mechanical design experience in semiconductor, power electronics, or advanced electronics cooling.
• Expert proficiency in SolidWorks for 3D mechanical design.
• Deep knowledge of liquid cooling systems, including cold plates and manifolds.
• Experience designing heat sinks, vapor chambers, TIM interfaces, and package-level thermal solutions.
• Strong understanding of packaging constraints, reliability, and manufacturability.
• Ability to lead programs independently and communicate with executive and technical teams.

Responsibilities

• Lead thermal design and development of advanced semiconductor power solutions (IVR, VRM, modules).
• Architect thermal management using liquid cooling, cold plates, manifolds, heat sinks, and TIMs.
• Perform detailed thermal simulations (ANSYS Icepak, FloTHERM) and CFD methods.
• Develop and optimize mechanical designs using SolidWorks for thermal assemblies.
• Conduct steady-state and transient analysis to improve performance and manufacturability.
• Mentor junior engineers and lead thermal initiatives across programs.
• Influence product roadmap decisions related to thermal performance and system integration.

Job description

• Lead thermal design and development of advanced semiconductor power solutions, including IVR, VRM, and power module platforms
• Architect thermal management solutions for high power-density products utilizing liquid cooling, cold plates, manifolds, heat sinks, and TIM materials
• Perform detailed thermal simulations using ANSYS Icepak, FloTHERM, FEAtools, and CFD methodologies
• Develop and optimize mechanical designs using SolidWorks for thermal assemblies and packaging solutions.
• Conduct steady-state and transient thermal analysis to improve performance, reliability, and manufacturability.
• Evaluate and select thermal interface materials (TIMs), cooling technologies, and advanced materials for semiconductor applications.
• Partner cross-functionally with electrical, package, reliability, manufacturing, and systems engineering teams.
• Drive prototype builds, thermal validation, and correlation between simulation and lab data.
• Mentor junior engineers and provide technical leadership across thermal engineering initiatives.
• Influence product roadmap decisions related to thermal performance, packaging, and system integration.

• Bachelor's or Master's degree in Mechanical Engineering or relateddiscipline. PhD is a plus. 8-10+ years of thermal/mechanical design experience within the semiconductor, power electronics, or advanced electronics cooling industry.
• Expert proficiency in SolidWorks for 3D mechanical design.
• Strong hands-on experience with FloTHERM, ANSYS Icepak, and FiniteElement Analysis (FEA) tools.
• Deep knowledge of liquid cooling systems, including cold plates,manifolds, pumps, and coolant flow optimization.
• Experience designing heat sinks, vapor chambers, TIM interfaces, and package level thermal solutions.
• Strong understanding of semiconductor packaging constraints,reliability, and manufacturability.
• Ability to lead programs independently and communicate effectively with executive and technical teams.

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion.

We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience.

Even if you don't meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

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