Senior Power Device Modeling & Product Design Lead

Infineon Technologies AG

El Segundo (CA)

On-site

USD 121,000 - 166,000

Full time

10 days ago

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Job summary

Infineon Technologies AG in El Segundo, CA, is seeking a Senior Staff Engineer for Power Device Modeling and Product Design on our Research & Development team. You will translate customer needs into MOSFET specifications while balancing efficiency, ruggedness, die area, and manufacturability for integrated power products.

The role involves chip- and system-level simulations, SPICE model development, and collaboration across technology, design, packaging, and application teams through

Qualifications

  • Degree in Electrical Engineering, Physics or related field; master’s/PhD preferred.
  • Strong understanding of silicon power MOSFET device physics and design trade-offs.
  • Hands-on SPICE model development and circuit simulation experience.

Responsibilities

  • Define product concepts and design targets translating requirements into MOSFET specs.
  • Perform chip- and system-level simulations to guide architecture and trade-offs.
  • Develop and calibrate SPICE models against characterization data.
  • Collaborate with tech, design, packaging, and application teams through qualification.
  • Advance workflows with AI-assisted coding and data-analysis tools.

Skills

Power device modeling
SPICE modeling
Python scripting
Analytical thinking
Cross-functional collaboration
Problem solving

Education

Electrical Engineering degree
Advanced degree preferred

Tools

Cadence Spectre
SIMetrix
LTspice
TCAD

Job description

Infineon Technologies AG in El Segundo, CA, is seeking a Senior Staff Engineer for Power Device Modeling and Product Design on our Research & Development team. You will translate customer needs into MOSFET specifications while balancing efficiency, ruggedness, die area, and manufacturability for integrated power products.

The role involves chip- and system-level simulations, SPICE model development, and collaboration across technology, design, packaging, and application teams through

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