Lead Thermal Design Engineer - Power & Cooling Expert

Infineon Technologies AG

San Jose (CA)

Hybrid

USD 223,000 - 307,000

Full time

14 days+

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Job summary

Infineon Technologies AG in San Jose, CA is seeking a Thermal Design Engineer - Lead Principal to lead thermal design and development of high‑power semiconductor solutions and modules in a hybrid work environment.

You will architect thermal management using liquid cooling, cold plates, manifolds, and TIMs, and conduct advanced simulations with FloTHERM, ANSYS Icepak, and FEA tools. Collaboration with multiple engineering teams is essential.

Qualifications

  • 8-10+ years of thermal/mechanical design experience in semiconductor, power electronics, or electronics cooling.
  • Bachelor’s or Master’s degree required; PhD a plus.
  • Strong proficiency in SolidWorks for 3D mechanical design.
  • Hands-on experience with FloTHERM, ANSYS Icepak, and FEA tools.

Responsibilities

  • Lead thermal design for high‑power semiconductor solutions and modules.
  • Architect thermal management using liquid cooling, cold plates, manifolds and TIMs.
  • Perform steady-state and transient thermal analyses.
  • Develop mechanical designs in SolidWorks for thermal assemblies.
  • Drive prototype builds and validate thermal performance against lab data.
  • Mentor junior engineers and influence product roadmaps.

Skills

Program leadership
Thermal design
Semiconductor power electronics
Engineering coordination

Education

Bachelor’s degree in Mechanical Engineering or related field
Master’s degree in Mechanical Engineering or related field
PhD (a plus)

Tools

FloTHERM
ANSYS Icepak
FEA tools
SolidWorks

Job description

Infineon Technologies AG in San Jose, CA is seeking a Thermal Design Engineer - Lead Principal to lead thermal design and development of high‑power semiconductor solutions and modules in a hybrid work environment.

You will architect thermal management using liquid cooling, cold plates, manifolds, and TIMs, and conduct advanced simulations with FloTHERM, ANSYS Icepak, and FEA tools. Collaboration with multiple engineering teams is essential.

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