Substrate/Package Layout Engineer

Broadcom Inc.; Wayne (CA); On-site; USD 141,300 - 226,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(k) participation with company matching

Employee Stock Purchase Program (ESPP)

Job summary

Broadcom Inc. is seeking an experienced IC Substrate and Package/Interposer Layout Engineer in Wayne, California. This role involves designing and laying out advanced substrates and IC packages, ensuring that specifications and performance requirements are met while collaborating closely with various engineering teams.

The ideal candidate should have substantial experience with Cadence tools and a strong understanding of multilayer high-speed RF-design. Broadcom offers competitive compensation along with extensive benefits, including medical and stock options.

Qualifications

• At least 12 years of experience in related fields.
• 10+ years of experience with a Master's or 7+ years with a PhD.
• Deep knowledge of package/substrate manufacturing processes.

Responsibilities

• Design and layout advanced substrates and IC packages.
• Collaborate with design and verification teams.
• Develop and improve layout methodologies and flows.

Skills

Expertise with Cadence layout tools

Design rule checking (DRC)

Layout vs schematic (LVS) check

Knowledge of multilayer high-speed RF-design

Script-based layout tools

Education

Bachelor's degree in Material Science/Electrical/Computer/Mechanical Engineering

Master's degree or PhD with relevant experience

Tools

Calibre/Klayout

Cadence Allegro Package Design

Cadence Innovus

Cadence Virtuoso

Job description

Job Description

Broadcom OSD is looking for an IC Substrate and Package/Interposer Layout Engineer. In the role, you will have primary responsibility for the layout, routing, and functionality of packages and substrates, including design of high‑speed lines. Expertise with design tools, such as Calibre/Klayout and Cadence tools (e.g. Allegro Package Design, Innovus, and Virtuoso) is required.

You will work closely with core members of the design team, mechanical engineers, electrical engineers, power/signal integrity engineers, and project managers. Peer reviews of substrate/package designs is also an important element of the role. You will work with substrate/package vendors to define layout/panel/stack‑up design and other specifications. In addition to the front‑end layout work, you will also help evaluate the parts when they come back from the fab, including visual inspection, electrical functionality, and characterization of the high‑speed electrical lines.

Responsibilities

• Design and layout advanced substrates and IC packages
• Develop and utilize script‑based layout tools
• Collaborate with design and verification teams to ensure layout meets specifications and performance requirements
• Perform design rule checking (DRC) and layout vs schematic (LVS) check
• Contribute to the development and improvement of layout methodologies and flows

Qualifications

• Bachelors degree in Material Science/ Electrical/ Computer/Mechanical Engineering or related science/engineering degree with at least 12 years experience
• Or Masters degree and 10+ years of related experience or PhD and 7+ years of related experience
• Deep knowledge and expertise with using Cadence layout tools and Electronic Design Automation (EDA) tools
• Broad understanding of multilayer high‑speed RF‑design, package/substrate manufacturing processes and materials, and surface mount technology
• Simulations of designs and improvement suggestions

Compensation and Benefits

The annual base salary range for this position is $141,300 - $226,000. As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(k) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Equal Opportunity Employment

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.