Senior Package Substrate EDA R&D Architect

Synopsys Inc; Austin (TX); On-site; USD 180,000 - 230,000; Full time

Benefits offered by this job

Health benefits

Wellness programs

Financial rewards

Job summary

Synopsys Inc. seeks a senior engineer to lead R&D in package substrate design automation, driving auto-routing, DRC verification, and power delivery analysis.

You will work on database models for schematic-driven layouts and integrate across the packaging tool suite. You will collaborate with foundries and OSATs to implement emerging substrate technologies, translate DRM requirements into functional tooling, and guide a team through complex design challenges with a hands-on implementation

Qualifications

• Bachelor's or Master's in EE/CE/CS or equivalent EDA experience.
• 10+ years of experience in EDA software development focused on physical design automation.
• Deep expertise in package substrate physical design methodologies.
• Experience collaborating with foundries/OSATs on Design Rule Manuals, technology files, and ODB++ formats.
• Strong programming proficiency in Python or TCL for tool integration.

Responsibilities

• Lead R&D projects that advance package substrate design automation, including auto-routing, DRC verification engines, and power delivery analysis.
• Drive technical direction for database models enabling schematic-driven layouts and integration across tool suites.
• Develop and optimize EDA software using Python and TCL for computational geometry and constraint solving.
• Collaborate with foundries and OSATs to implement substrate technologies and translate requirements into tooling.
• Define input/output formats, integrate analysis capabilities, and ensure scalable database architectures for complex designs.
• Provide technical guidance to engineers and review designs to navigate technical tradeoffs.
• Engage with customers in technical discussions at senior levels about substrate design methodology and product direction.

Skills

Python

TCL

Computational geometry

Leadership

Problem solving

Education

Bachelor's/Master's in EE/CE/CS

Tools

ODB++

Job description

Synopsys Inc. seeks a senior engineer to lead R&D in package substrate design automation, driving auto-routing, DRC verification, and power delivery analysis.

You will work on database models for schematic-driven layouts and integrate across the packaging tool suite. You will collaborate with foundries and OSATs to implement emerging substrate technologies, translate DRM requirements into functional tooling, and guide a team through complex design challenges with a hands-on implementation