Senior Structural Analyst — Space Electronics Packaging

BLUE ORIGIN; Denver (CO); On-site; USD 134,000 - 187,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

Life insurance

Parental leave

Disability insurance

401(k) match

Education support

Stock options

Paid time off

Company holidays

Job summary

Blue Origin is seeking a Senior Structural Analyst – Electronics Packaging to own end-to-end structural analyses for LRUs, avionics enclosures, and electronics assemblies used in the TeraWave satellite program. You will collaborate with mechanical, electrical, and thermal teams to ensure robust, lightweight, and producible hardware for space deployment.

You will develop and maintain FEA and analytical models, verify structural performance under launch and on-orbit environments, and mentor junior

Qualifications

• Bachelor’s degree in Mechanical, Aerospace, Structural Engineering, or related field.
• 8+ years of structural analysis experience with aerospace or high-reliability hardware.
• Experience analyzing avionics, electronics packaging, enclosures, LRUs, PCBAs, or similar hardware for vibration, shock, and thermal environments.
• Proficiency with FEA tools such as NASTRAN, ANSYS, Abaqus, FEMAP, HyperMesh, or equivalent.
• Strong knowledge of bolted joints, fasteners, brackets, plates, beams, inserts, load paths, margins, and fatigue.
• Experience with dynamic environments, including modal, random vibration, sine vibration, and shock.
• Experience supporting qualification or acceptance testing, including planning, instrumentation, data review, model correlation, and anomaly resolution.
• Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Responsibilities

• Own structural analysis for TeraWave satellite LRUs, avionics enclosures, electronics assemblies, and power electronics from concept through qualification and production release.
• Analyze electronics packaging hardware, including chassis, covers, mounting interfaces, card guides, wedge locks, fasteners, brackets, connectors, PCBAs/CCAs, and internal supports.
• Build and maintain detailed FEA and simplified analytical models using NASTRAN, ANSYS, Abaqus, or equivalent tools.
• Verify strength, stiffness, modal response, vibration, shock, fatigue, thermal-mechanical performance, and load paths using FEA and classical methods such as Steinberg or Engelmaier.
• Define structural environments, assumptions, boundary conditions, and interface loads with structures, systems, design, and test teams.
• Assess margins of safety for enclosures, bolted joints, inserts, card retention features, solder joints, components, connectors, and mounting feet.
• Support packaging trades for mass, stiffness, manufacturability, access, connector placement, card retention, and robustness.
• Partner with mechanical design engineers to drive structural requirements into enclosure design, PCB layout, component placement, and mounting strategy.
• Maintain structural interfaces, ICDs, analysis plans, model documentation, and verification artifacts.
• Define structural test requirements and support qualification/acceptance testing, including vibration, shock, sine burst, modal, and environmental campaigns.
• Correlate models to test data, investigate anomalies, and recommend design or process improvements.
• Review supplier analyses and test data for compliance with Blue Origin and TeraWave requirements.
• Author analysis reports, margin summaries, test plans, test reports, and certification documentation.
• Present analysis results, risks, and recommendations at design, qualification, and production readiness reviews.
• Mentor junior analysts and design engineers in electronics packaging analysis methods.
• Develop repeatable analysis methods, templates, and allowables for high-rate satellite production.

Skills

FEA tools

Vibration analysis

Modal analysis

Thermal-mechanical analysis

Education

Bachelor’s degree in Mechanical/Aerospace/Structural Engineering

Master’s degree preferred

Tools

NASTRAN

ANSYS

Abaqus

FEMAP

HyperMesh

Job description

Blue Origin is seeking a Senior Structural Analyst – Electronics Packaging to own end-to-end structural analyses for LRUs, avionics enclosures, and electronics assemblies used in the TeraWave satellite program. You will collaborate with mechanical, electrical, and thermal teams to ensure robust, lightweight, and producible hardware for space deployment.

You will develop and maintain FEA and analytical models, verify structural performance under launch and on-orbit environments, and mentor junior