Senior STA Signoff Architect — Lead Timing & Closure

Cadence Design Systems; United States; On-site; USD 154,000 - 286,000; Full time

Benefits offered by this job

Paid vacation

401(k) plan with employer match

Employee stock purchase plan

Medical, dental and vision plan

Job summary

Cadence Design Systems seeks a senior leader to drive customer engagements and adoption of our timing signoff portfolio. You will collaborate with design teams to meet success metrics on advanced nodes (5nm and below) and influence tool enhancements through close partnership with R&D and Product Engineering.

The role demands strong scripting skills and proven multi-team leadership. Based in the United States, this position offers exposure to cutting-edge signoff methodologies, industry forums,

Qualifications

• 15+ years of experience in IC design implementation and signoff.
• Deep expertise in digital design fundamentals, advanced node STA & ECOs (3nm and below).
• Core timing signoff expertise and constraints debugging.
• Proven track record leading technical teams and driving customer success at executive levels.
• Strong scripting skills (Tcl, Python, Perl) and flow customization for design closure.

Responsibilities

• Lead technical engagements with customers and partners to drive adoption of Cadence signoff portfolio.
• Collaborate with design teams to meet customer success metrics and guide adoption across advanced nodes.
• Influence tool enhancements with R&D and Product Engineering based on customer requirements.
• Drive benchmarks, flow optimizations, and deployment of methodologies for timing signoff, STA, IR Drop, power/timing closure.
• Represent Cadence at industry forums, author technical papers, and deliver keynote presentations.

Skills

Tcl

Python

Perl

Education

B.S. in Electrical Engineering

M.S. in Electrical/Computer Engineering

Tools

Tempus

Certus

QRC

Job description

Cadence Design Systems seeks a senior leader to drive customer engagements and adoption of our timing signoff portfolio. You will collaborate with design teams to meet success metrics on advanced nodes (5nm and below) and influence tool enhancements through close partnership with R&D and Product Engineering.

The role demands strong scripting skills and proven multi-team leadership. Based in the United States, this position offers exposure to cutting-edge signoff methodologies, industry forums,